2.75-W Mono Class-D Audio Amplifier with 4 V/V Fixed Gain (TPA2034) 9-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | VFBGA, BGA9,3X3,20 |
| 针数 | 9 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 标称带宽 | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| 增益 | 32 dB |
| JESD-30 代码 | S-XBGA-B9 |
| JESD-609代码 | e1 |
| 长度 | 1.75 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 2.75 W |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA9,3X3,20 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.625 mm |
| 最大压摆率 | 5.7 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.75 mm |
| Base Number Matches | 1 |
| TPA2034D1YZFT | TPA2032D1YZFR | TPA2032D1YZFT | TPA2033D1YZFR | |
|---|---|---|---|---|
| 描述 | 2.75-W Mono Class-D Audio Amplifier with 4 V/V Fixed Gain (TPA2034) 9-DSBGA -40 to 85 | 2.75-W Mono Class-D Audio Amplifier with 2 V/V Fixed Gain (TPA2032) 9-DSBGA -40 to 85 | 2.75-W Mono Class-D Audio Amplifier with 2 V/V Fixed Gain (TPA2032) 9-DSBGA -40 to 85 | 2.75-W Mono Class-D Audio Amplifier with 3 V/V Fixed Gain (TPA2033) 9-DSBGA -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | VFBGA, BGA9,3X3,20 | VFBGA, BGA9,3X3,20 | VFBGA, BGA9,3X3,20 | VFBGA, BGA9,3X3,20 |
| 针数 | 9 | 9 | 9 | 9 |
| Reach Compliance Code | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week |
| 标称带宽 | 20 kHz | 20 kHz | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| 增益 | 32 dB | 6 dB | 9.5 dB | 12 dB |
| JESD-30 代码 | S-XBGA-B9 | S-XBGA-B9 | S-XBGA-B9 | S-XBGA-B9 |
| JESD-609代码 | e1 | e1 | e1 | e1 |
| 长度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 9 | 9 | 9 | 9 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 2.75 W | 2.75 W | 2.75 W | 2.75 W |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | VFBGA | VFBGA | VFBGA | VFBGA |
| 封装等效代码 | BGA9,3X3,20 | BGA9,3X3,20 | BGA9,3X3,20 | BGA9,3X3,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.625 mm | 0.625 mm | 0.625 mm | 0.625 mm |
| 最大压摆率 | 5.7 mA | 5.7 mA | 5.7 mA | 5.7 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Base Number Matches | 1 | 1 | 1 | - |
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