|
TPA6203A1DRB |
TPA6203A1ZQVR |
TPA6203A1GQVR |
TPA6203A1DRBR |
TPA6203A1DRBRG4 |
TPA6203A1DGNRG4 |
TPA6203A1DRBG4 |
TPA6203A1DGNG4 |
TPA6203A1DGN |
| 描述 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-BGA MICROSTAR JUNIOR -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-BGA MICROSTAR JUNIOR -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
1.25-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| 是否Rohs认证 |
符合 |
符合 |
不符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
| 零件包装代码 |
SON |
BGA |
BGA |
SON |
SON |
SOIC |
SON |
SOIC |
SOIC |
| 包装说明 |
HVQCCN, |
VFBGA, BGA8,3X3,20 |
VFBGA, BGA8,3X3,20 |
HVQCCN, |
HVQCCN, |
HTSSOP, |
HVQCCN, |
HTSSOP, |
HTSSOP, |
| 针数 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| Reach Compliance Code |
compli |
compli |
_compli |
compli |
compli |
compli |
compli |
compli |
compli |
| ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| 标称带宽 |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
20 kHz |
| 商用集成电路类型 |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
AUDIO AMPLIFIER |
| 谐波失真 |
1% |
1% |
1% |
1% |
1% |
1% |
1% |
1% |
1% |
| JESD-30 代码 |
S-PQCC-N8 |
S-PBGA-B8 |
S-PBGA-B8 |
S-PQCC-N8 |
S-PQCC-N8 |
S-PDSO-G8 |
S-PQCC-N8 |
S-PDSO-G8 |
S-PDSO-G8 |
| JESD-609代码 |
e4 |
e1 |
e0 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
| 长度 |
3 mm |
2 mm |
2 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
| 湿度敏感等级 |
2 |
2 |
2 |
2 |
2 |
1 |
2 |
1 |
1 |
| 信道数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| 功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| 端子数量 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| 标称输出功率 |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
1.25 W |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
HVQCCN |
VFBGA |
VFBGA |
HVQCCN |
HVQCCN |
HTSSOP |
HVQCCN |
HTSSOP |
HTSSOP |
| 封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| 封装形式 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) |
260 |
260 |
235 |
260 |
260 |
260 |
260 |
260 |
260 |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| 座面最大高度 |
1 mm |
1 mm |
1 mm |
1 mm |
1 mm |
1.1 mm |
1 mm |
1.1 mm |
1.1 mm |
| 最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| 最小供电电压 (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| 表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
| 技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Lead (Sn/Pb) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 |
NO LEAD |
BALL |
BALL |
NO LEAD |
NO LEAD |
GULL WING |
NO LEAD |
GULL WING |
GULL WING |
| 端子节距 |
0.65 mm |
0.5 mm |
0.5 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
| 端子位置 |
QUAD |
BOTTOM |
BOTTOM |
QUAD |
QUAD |
DUAL |
QUAD |
DUAL |
DUAL |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| 宽度 |
3 mm |
2 mm |
2 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
3 mm |
| 厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
- |
- |
- |
Texas Instruments(德州仪器) |
| Factory Lead Time |
1 week |
1 week |
1 week |
1 week |
- |
- |
1 week |
1 week |
1 week |