Microprocessor Circuit, CMOS, CDIP16, HERMETIC SEALED, CERDIP-16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | DIP |
包装说明 | DIP, DIP16,.3 |
针数 | 16 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-CDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.6215 mm |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B (Modified) |
座面最大高度 | 5.08 mm |
最大压摆率 | 115 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT |
AM29811ADMB | AM29811AFMB | AM29811ADC | AM29811ADCB | AM29811APC | |
---|---|---|---|---|---|
描述 | Microprocessor Circuit, CMOS, CDIP16, HERMETIC SEALED, CERDIP-16 | Microprocessor Circuit, CMOS, CDFP16, FP-16 | Microprocessor Circuit, CMOS, CDIP16, HERMETIC SEALED, CERDIP-16 | Microprocessor Circuit, CMOS, CDIP16, HERMETIC SEALED, CERDIP-16 | Microprocessor Circuit, CMOS, PDIP16, PLASTIC, DIP-16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
零件包装代码 | DIP | DFP | DIP | DIP | DIP |
包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
针数 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-CDIP-T16 | R-CDFP-F16 | R-CDIP-T16 | R-CDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIP | DFP | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 115 mA | 115 mA | 115 mA | 115 mA | 115 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT | MICROPROCESSOR CIRCUIT |
长度 | 19.6215 mm | - | 19.6215 mm | 19.6215 mm | 19.304 mm |
座面最大高度 | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm |
宽度 | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm |
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