|
SN74CBTS3306DR |
SN74CBTS3306D |
SN74CBTS3306PW |
SN74CBTS3306PWR |
SN74CBTS3306PWE4 |
描述 |
Dual FET Bus Switch With Schottky Diode Clamping 8-SOIC -40 to 85 |
Dual FET Bus Switch With Schottky Diode Clamping 8-SOIC -40 to 85 |
Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85 |
Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85 |
Dual FET Bus Switch With Schottky Diode Clamping 8-TSSOP -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
SOIC |
SOIC |
SOIC |
SOIC |
SOIC |
包装说明 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
TSSOP-8 |
TSSOP, TSSOP8,.25 |
TSSOP, TSSOP8,.25 |
针数 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
Factory Lead Time |
1 week |
1 week |
1 week |
1 week |
6 weeks |
其他特性 |
BUS SWITCH |
BUS SWITCH |
BUS SWITCH |
BUS SWITCH |
BUS SWITCH |
控制类型 |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
ENABLE LOW |
计数方向 |
BIDIRECTIONAL |
BIDIRECTIONAL |
BIDIRECTIONAL |
BIDIRECTIONAL |
BIDIRECTIONAL |
系列 |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
CBT/FST/QS/5C/B |
JESD-30 代码 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
4.9 mm |
4.9 mm |
4.4 mm |
3 mm |
3 mm |
负载电容(CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
逻辑集成电路类型 |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
BUS DRIVER |
湿度敏感等级 |
1 |
1 |
1 |
1 |
1 |
位数 |
2 |
2 |
2 |
2 |
2 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
端口数量 |
2 |
2 |
2 |
2 |
2 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
输出特性 |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
输出极性 |
TRUE |
TRUE |
TRUE |
TRUE |
TRUE |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SOP |
SOP |
TSSOP |
TSSOP |
TSSOP |
封装等效代码 |
SOP8,.25 |
SOP8,.25 |
TSSOP8,.25 |
TSSOP8,.25 |
TSSOP8,.25 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 |
TR |
TUBE |
TUBE |
TR |
TUBE |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
最大电源电流(ICC) |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
0.003 mA |
Prop。Delay @ Nom-Su |
0.25 ns |
0.25 ns |
0.25 ns |
0.25 ns |
0.25 ns |
传播延迟(tpd) |
0.35 ns |
0.35 ns |
0.35 ns |
0.35 ns |
0.35 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.75 mm |
1.75 mm |
1.2 mm |
1.2 mm |
1.2 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
4 V |
4 V |
4 V |
4 V |
4 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
1.27 mm |
1.27 mm |
0.65 mm |
0.65 mm |
0.65 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
翻译 |
N/A |
N/A |
N/A |
N/A |
N/A |
宽度 |
3.91 mm |
3.91 mm |
3 mm |
4.4 mm |
4.4 mm |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
Base Number Matches |
1 |
1 |
- |
1 |
- |