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RTPXA270C0C624: 产品描述SOC PXA270 356-Pin VFBGA; 文件大小89KB，共4页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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RTPXA270C0C624概述

SOC PXA270 356-Pin VFBGA

RTPXA270C0C624规格参数

参数名称	属性值
欧盟限制某些有害物质的使用	Compliant
HTS	8542.39.00.01
Family Name	PXA270
Maximum Clock Rate (MHz)	624
Program Memory Type	Flash
RAM Size	256KB
类型 Type	System-On-Chip
Processing Unit	Microprocessor
PWM	4
Watchdog	1
Minimum Operating Temperature (°C)	-25
Maximum Operating Temperature (°C)	85
接口类型 Interface Type	I2S/UART/USB
SPI	1
I2C	0
I2S	1
UART	3
USB	1
USART	0
CAN	0
Ethernet	0
Programmability	Yes
Supplier Package	VFBGA
Pin Count	356
Standard Package Name	BGA
Mounting	Surface Mount
Package Height	0.7(Max)
Package Length	13
Package Width	13
PCB changed	356
Lead Shape	Ball

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Product Brief

Intel

PXA270 Development

Platform:

Portable Media Player

Intel

PXA270 Development Platform:

Portable Media Player

Pictures, music and video are all quickly making

the transition to digital formats. Consumers

now have the ability to do things that were

once only dreamed of—sharing digital pic-

tures across the globe, digitally recording

a TV show and watching it on a portable

device, downloading a movie off the Web,

creating audio mixes in minutes, and many

more functions are possible today.

The Intel

PXA270 Development Platform:

Portable Media Player

is a platform that lever-

ages the outstanding capabilities of Intel XScale

technology based processors, providing a complete hardware and software

package, to enable faster time to market.

This new platform combines industry standard tools such as JTAG debug-

ging, Intel debugging tools, Microsoft Platform Builder*, and a wide array

of peripheral support in a single robust development platform. A broad

commitment from Microsoft* for software and board support packages

for both Microsoft Windows Mobile* 5.0 and Linux* make the Intel PXA270

Development Platform:

Portable Media Player

an ideal solution for the most

popular digital applications today.

Built on the foundation of Intel XScale

Technology

Designed to optimize low power consumption and high performance processing, the Intel PXA270

Development Platform:

Portable Media Player

is based on Intel XScale

microarchitecture with Intel

Wireless MMX

™

technology. Intel XScale technology based processors deliver advanced integration,

leading multimedia performance and superior power savings across a wide range of applications and

rich services for handheld devices.

The Intel PXA270 Development Platform:

Portable Media Player

takes advantage of some of the most

advanced features developed on the Intel XScale technology based platforms:

•

Wireless Intel SpeedStep

Power Manager

delivers the ability to dynamically adjust the

frequency and voltage of the processor for advanced power savings.

•

Intel

Wireless Trusted Platform

provides fundamental security building blocks in hardware and

software to protect content and secure user information.

•

Intel

VTune

™

Performance Analyzer

locates and removes performance bottlenecks.

•

Intel

Integrated Performance Primitives (Intel

IPP)

are cross-platform libraries that increase

application performance and functionality while speeding development.

•

Intel

Thread Compiler

implements various optimization techniques including scheduling, support

for double load and store, interprocedural optimization, and more.

RTPXA270C0C624相似产品对比

	RTPXA270C0C624	NHPXA270C0C312	NHPXA270C0E312	NHPXA270C0C416	RTPXA270C0C416	RTPXA270C0C312	RTPXA270C0C520	NHPXA270C0C520
描述	SOC PXA270 356-Pin VFBGA	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 312MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 416MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360	RISC Microprocessor, 32-Bit, 416MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 32-Bit, 312MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 32-Bit, 520MHz, CMOS, PBGA356, 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356	RISC Microprocessor, 520MHz, CMOS, PBGA360, 23 X 23 MM, 1.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-360
是否Rohs认证	-	符合	符合	符合	符合	符合	符合	符合
零件包装代码	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	-	BGA,	BGA,	BGA,	VFBGA, BGA356,24X24,20	VFBGA, BGA356,24X24,20	VFBGA, BGA356,24X24,20	BGA,
针数	-	360	360	360	356	356	356	360
Reach Compliance Code	-	compliant	compliant	compliant	compliant	compliant	compliant	compliant
地址总线宽度	-	26	26	26	26	26	26	26
边界扫描	-	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	-	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz	13.002 MHz
外部数据总线宽度	-	32	32	32	32	32	32	32
格式	-	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
集成缓存	-	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	-	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	S-PBGA-B356	S-PBGA-B356	S-PBGA-B356	S-PBGA-B360
JESD-609代码	-	e1	e1	e1	e1	e1	e1	e1
长度	-	23 mm	23 mm	23 mm	13 mm	13 mm	13 mm	23 mm
低功率模式	-	YES	YES	YES	YES	YES	YES	YES
端子数量	-	360	360	360	356	356	356	360
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	BGA	BGA	BGA	VFBGA	VFBGA	VFBGA	BGA
封装形状	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY
峰值回流温度（摄氏度）	-	260	260	260	260	260	260	260
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	-	2.59 mm	2.59 mm	2.59 mm	1 mm	1 mm	1 mm	2.59 mm
速度	-	312 MHz	312 MHz	416 MHz	416 MHz	312 MHz	520 MHz	520 MHz
最大供电电压	-	1.705 V	1.705 V	1.705 V	1.705 V	1.705 V	1.705 V	1.705 V
最小供电电压	-	1.1875 V	1.1875 V	1.2825 V	1.2825 V	1.1875 V	1.3775 V	1.3775 V
标称供电电压	-	1.25 V	1.25 V	1.35 V	1.35 V	1.25 V	1.45 V	1.45 V
表面贴装	-	YES	YES	YES	YES	YES	YES	YES
技术	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子面层	-	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
端子形式	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	-	1 mm	1 mm	1 mm	0.5 mm	0.5 mm	0.5 mm	1 mm
端子位置	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	-	40	40	40	40	40	40	40
宽度	-	23 mm	23 mm	23 mm	13 mm	13 mm	13 mm	23 mm
uPs/uCs/外围集成电路类型	-	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
厂商名称	-	-	-	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)

RTPXA270C0C624

RTPXA270C0C624概述

RTPXA270C0C624规格参数

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RTPXA270C0C624相似产品对比

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