EDO DRAM Module, 16MX72, 50ns, CMOS
参数名称 | 属性值 |
厂商名称 | SAMSUNG(三星) |
包装说明 | DIMM, DIMM168 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE WITH EDO |
最长访问时间 | 50 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N168 |
内存密度 | 1207959552 bit |
内存集成电路类型 | EDO DRAM MODULE |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 168 |
字数 | 16777216 words |
字数代码 | 16000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 16MX72 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM168 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
电源 | 5 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
座面最大高度 | 31.75 mm |
最大待机电流 | 0.03 A |
最大压摆率 | 1.8 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | DUAL |
KMM372E1680CS-5 | KMM372E1680CK-5 | KMM372E1600CK-5 | KMM372E1680CK-6 | KMM372E1680CS-6 | KMM372E1600CS-5 | KMM372E1600CK-6 | |
---|---|---|---|---|---|---|---|
描述 | EDO DRAM Module, 16MX72, 50ns, CMOS | EDO DRAM Module, 16MX72, 50ns, CMOS | EDO DRAM Module, 16MX72, 50ns, CMOS | EDO DRAM Module, 16MX72, 60ns, CMOS | EDO DRAM Module, 16MX72, 60ns, CMOS | EDO DRAM Module, 16MX72, 50ns, CMOS | EDO DRAM Module, 16MX72, 60ns, CMOS |
厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
包装说明 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 | DIMM, DIMM168 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 50 ns | 50 ns | 50 ns | 60 ns | 60 ns | 50 ns | 60 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
内存密度 | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit | 1207959552 bit |
内存集成电路类型 | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 | 16MX72 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 4096 | 8192 | 8192 | 4096 | 4096 |
座面最大高度 | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm |
最大待机电流 | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A | 0.03 A |
最大压摆率 | 1.8 mA | 1.8 mA | 2.16 mA | 1.62 mA | 1.62 mA | 1.98 mA | 2.16 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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