XOR Gate, CMOS, PDIP14,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | RCA |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | XOR GATE |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| Prop。Delay @ Nom-Sup | 280 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| CD4070BE | CD4070BD | CD4070BH | CD4077BD | CD4077BH | CD4070BF | CD4077BF | CD4077BE | |
|---|---|---|---|---|---|---|---|---|
| 描述 | XOR Gate, CMOS, PDIP14, | XOR Gate, CMOS, CDIP14, | XOR Gate, CMOS, | XNOR Gate, CMOS, CDIP14, | XNOR Gate, CMOS, | XOR Gate, CMOS, CDIP14, | XNOR Gate, CMOS, CDIP14, | XNOR Gate, CMOS, PDIP14, |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | , DIE OR CHIP | DIP, DIP14,.3 | , DIE OR CHIP | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 逻辑集成电路类型 | XOR GATE | XOR GATE | XOR GATE | XNOR GATE | XNOR GATE | XOR GATE | XNOR GATE | XNOR GATE |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIE OR CHIP | DIP14,.3 | DIE OR CHIP | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | 不符合 |
| JESD-30 代码 | R-PDIP-T14 | R-XDIP-T14 | - | R-XDIP-T14 | - | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609代码 | e0 | e0 | - | e0 | - | e0 | e0 | e0 |
| 端子数量 | 14 | 14 | - | 14 | - | 14 | 14 | 14 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | - | CERAMIC | - | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | - | DIP | - | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | - | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | NO | NO | - | NO | - | NO | NO | NO |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | - | DUAL | DUAL | DUAL |
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