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IDT7187L55DBG

产品描述Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22
产品类别存储    存储   
文件大小469KB,共8页
制造商IDT (Integrated Device Technology)
标准  
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IDT7187L55DBG概述

Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, CERAMIC, DIP-22

IDT7187L55DBG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码DIP
包装说明0.300 INCH, CERAMIC, DIP-22
针数22
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最长访问时间55 ns
JESD-30 代码R-GDIP-T22
JESD-609代码e3
长度27.051 mm
内存密度65536 bit
内存集成电路类型STANDARD SRAM
内存宽度1
功能数量1
端口数量1
端子数量22
字数65536 words
字数代码64000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织64KX1
输出特性3-STATE
可输出NO
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
座面最大高度5.08 mm
最小待机电流2 V
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层MATTE TIN
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度7.62 mm

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CMOS Static RAM
64K (64K x 1-Bit)
Features
High speed (equal access and cycle time)
– Military: 25/35/45/55/70/85ns (max.)
Low power consumption
Battery backup operation—2V data retention
(L version only)
JEDEC standard high-density 22-pin ceramic
DIP packaging
Produced with advanced CMOS high-performance
technology
Separate data input and output
Input and output directly TTL-compatible
Military product compliant to MIL-STD-883, Class B
IDT7187S
IDT7187L
Description
The IDT7187 is a 65,536-bit high-speed static RAM organized as 64K
x 1. It is fabricated using IDT’s high-performance, high-reliability CMOS
technology. Access times as fast as 25ns are available.
Both the standard (S) and low-power (L) versions of the IDT7187
provide two standby modes—I
SB
and I
SB1
. I
SB
provides low-power
operation; I
SB1
provides ultra-low-power operation. The low-power (L)
version also provides the capability for data retention using battery
backup. When using a 2V battery, the circuit typically consumes only
30µW.
Ease of system design is achieved by the IDT7187 with full
asynchronous operation, along with matching access and cycle times.
The device is packaged in an industry standard 22-pin, 300 mil ceramic
DIP.
Military grade product is manufactured in compliance with the latest
revision of MIL-STD-883, Class B, making it ideally suited to military
temperature applications demanding the highest level of performance
and reliability.
Functional Block Diagram
A
A
V
CC
A
A
A
A
A
CS
DATA
IN
COLUMN I/O
DATA
OUT
ROW
SELECT
65,536-BIT
MEMORY ARRAY
GND
WE
A
A
A
A
A
A
A
2986 drw 01
FEBRUARY 2001
1
©2000 Integrated Device Technology, Inc.
DSC-2986/09

 
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