Micro Peripheral IC, CMOS, PQFP52
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | QFP, QFP52,.7SQ,40 |
Reach Compliance Code | unknown |
最长访问时间 | 1.5e-7 ns |
JESD-30 代码 | S-PQFP-G52 |
JESD-609代码 | e0 |
端子数量 | 52 |
最高工作温度 | 80 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP52,.7SQ,40 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
ROM大小(位) | 512 Bits |
最大待机电流 | 0.00015 A |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1 mm |
端子位置 | QUAD |
紫外线可擦 | N |
PSD302-15IB | PSD302-12KA | PSD302-20KA | PSD302-20IB | PSD302-15B | PSD302-20IA | |
---|---|---|---|---|---|---|
描述 | Micro Peripheral IC, CMOS, PQFP52 | Micro Peripheral IC, CMOS, CQCC44 | Micro Peripheral IC, CMOS, CQCC44 | Micro Peripheral IC, CMOS, PQFP52 | Micro Peripheral IC, CMOS, PQFP52 | Micro Peripheral IC, CMOS, PQCC44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | QFP, QFP52,.7SQ,40 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | QFP, QFP52,.7SQ,40 | QFP, QFP52,.7SQ,40 | QCCJ, LDCC44,.7SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 1.5e-7 ns | 1.2e-7 ns | 2e-7 ns | 2e-7 ns | 1.5e-7 ns | 2e-7 ns |
JESD-30 代码 | S-PQFP-G52 | S-XQCC-J44 | S-XQCC-J44 | S-PQFP-G52 | S-PQFP-G52 | S-PQCC-J44 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 52 | 44 | 44 | 52 | 52 | 44 |
最高工作温度 | 80 °C | 70 °C | 70 °C | 80 °C | 70 °C | 85 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QCCJ | QCCJ | QFP | QFP | QCCJ |
封装等效代码 | QFP52,.7SQ,40 | LDCC44,.7SQ | LDCC44,.7SQ | QFP52,.7SQ,40 | QFP52,.7SQ,40 | LDCC44,.7SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM大小(位) | 512 Bits | 512 Bits | 512 Bits | 512 Bits | 512 Bits | 512 Bits |
最大待机电流 | 0.00015 A | 0.0001 A | 0.0001 A | 0.00015 A | 0.0001 A | 0.00015 A |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | J BEND | J BEND | GULL WING | GULL WING | J BEND |
端子节距 | 1 mm | 1.27 mm | 1.27 mm | 1 mm | 1 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
紫外线可擦 | N | Y | Y | N | N | N |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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