F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, FP-14
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 14 |
Reach Compliance Code | unknown |
系列 | F/FAST |
JESD-30 代码 | R-GDFP-F14 |
长度 | 9.614 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | OR GATE |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
最大电源电流(ICC) | 15.5 mA |
传播延迟(tpd) | 6.3 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.032 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | COMMERCIAL |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 6.35 mm |
74F32FCQR | 74F32SCQR | 74F32PCQR | 74F32DCQR | 74F32FC | |
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描述 | F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, FP-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, PDSO14, SOIC-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, CDIP14, CERAMIC, DIP-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, FP-14 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | DFP | SOIC | DIP | DIP | DFP |
包装说明 | DFP, | SOP, | DIP, DIP14,.3 | DIP, | DFP, |
针数 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | R-GDFP-F14 | R-PDSO-G14 | R-PDIP-T14 | R-GDIP-T14 | R-GDFP-F14 |
长度 | 9.614 mm | 8.65 mm | 19.215 mm | 19.43 mm | 9.614 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
功能数量 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DFP | SOP | DIP | DIP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | SMALL OUTLINE | IN-LINE | IN-LINE | FLATPACK |
最大电源电流(ICC) | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA |
传播延迟(tpd) | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.032 mm | 1.75 mm | 5.08 mm | 5.08 mm | 2.032 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES |
技术 | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | FLAT | GULL WING | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 6.35 mm | 3.9 mm | 7.62 mm | 7.62 mm | 6.35 mm |
Base Number Matches | - | 1 | 1 | 1 | - |
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