F/FAST SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | DIP |
包装说明 | DIP, DIP14,.3 |
针数 | 14 |
Reach Compliance Code | unknown |
Is Samacsys | N |
系列 | F/FAST |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
长度 | 19.215 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | OR GATE |
最大I(ol) | 0.02 A |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
最大电源电流(ICC) | 15.5 mA |
Prop。Delay @ Nom-Sup | 6.6 ns |
传播延迟(tpd) | 6.3 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
74F32PCQR | 74F32SCQR | 74F32DCQR | 74F32FCQR | 74F32FC | |
---|---|---|---|---|---|
描述 | F/FAST SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, PDSO14, SOIC-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, CDIP14, CERAMIC, DIP-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, FP-14 | F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, FP-14 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | DIP | SOIC | DIP | DFP | DFP |
包装说明 | DIP, DIP14,.3 | SOP, | DIP, | DFP, | DFP, |
针数 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-GDIP-T14 | R-GDFP-F14 | R-GDFP-F14 |
长度 | 19.215 mm | 8.65 mm | 19.43 mm | 9.614 mm | 9.614 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
功能数量 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | SOP | DIP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | FLATPACK | FLATPACK |
最大电源电流(ICC) | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA |
传播延迟(tpd) | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 1.75 mm | 5.08 mm | 2.032 mm | 2.032 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | FLAT | FLAT |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 3.9 mm | 7.62 mm | 6.35 mm | 6.35 mm |
Base Number Matches | 1 | 1 | 1 | - | - |
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