Very High CMR, Wide V
CC
Logic
Gate Optocouplers
Technical Data
HCPL-2201
HCPL-2211
HCPL-2231
HCPL-0201
HCNW2201
HCPL-2202
HCPL-2212
HCPL-2232
HCPL-0211
HCNW2211
Features
• 10 kV/
µ
s Minimum Common
Mode Rejection (CMR) at
V
CM
= 1000 V
(HCPL-2211/2212/0211/
2232, HCNW2211)
• Wide Operating V
CC
Range:
4.5 to 20 Volts
• 300 ns Propagation Delay
Guaranteed over the Full
Temperature Range
• 5 Mbd Typical Signal Rate
• Low Input Current (1.6 mA
to 1.8 mA)
• Hysteresis
• Totem Pole Output (No
Pullup Resistor Required)
• Available in 8-Pin DIP,
SOIC-8, Widebody Packages
• Guaranteed Performance
from -40
°
C to 85
°
C
• Safety Approval
UL Recognized -3750 V rms
for 1 minute (5000 V rms
for 1 minute for
HCNW22XX) per UL1577
CSA Approved
IEC/EN/DIN EN 60747-5-2
Approved with V
IORM
= 630
V
peak
(HCPL-2211/2212 Option
060 only) and V
IORM
= 1414
V
peak
(HCNW22XX only)
• MIL-PRF-38534 Hermetic
Version Available
(HCPL-52XX/62XX)
Description
The HCPL-22XX, HCPL-02XX,
and HCNW22XX are optically-
coupled logic gates. The
HCPL-22XX, and HCPL-02XX
contain a GaAsP LED while the
HCNW22XX contains an AlGaAs
LED. The detectors have totem
pole output stages and optical
receiver input stages with built-in
Schmitt triggers to provide logic-
compatible waveforms, eliminat-
ing the need for additional
waveshaping.
A superior internal shield on the
HCPL-2211/12, HCPL-0211,
Applications
• Isolation of High Speed
Logic Systems
• Computer-Peripheral
Interfaces
• Microprocessor System
Interfaces
• Ground Loop Elimination
• Pulse Transformer
Replacement
• High Speed Line Receiver
• Power Control Systems
Functional Diagram
HCPL-2201/11
HCPL-0201/11
HCNW2201/11
NC 1
ANODE 2
CATHODE 3
NC 4
8 V
CC
7 V
O
6 NC
5 GND
NC 1
ANODE 2
CATHODE 3
NC 4
HCPL-2202/12
8 V
CC
7 NC
6 V
O
5 GND
SHIELD
HCPL-2231/32
SHIELD
ANODE 1 1
CATHODE 1 2
CATHODE 2 3
ANODE 2 4
8 V
CC
7 V
O1
6 V
O2
5 GND
TRUTH TABLE
(POSITIVE LOGIC)
LED
V
O
HIGH
ON
LOW
OFF
SHIELD
A 0.1
µF
bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
2
HCPL-2232 and HCNW2211
guarantees common mode
transient immunity of 10 kV/µs at
a common mode voltage of 1000
volts.
The electrical and switching
characteristics of the HCPL-
22XX, HCPL-02XX and
HCNW22XX are guaranteed from
-40°C to +85°C and a V
CC
from
4.5 volts to 20 volts. Low I
F
and
Selection Guide
Minimum CMR
dV/dt
(V/
µ
s)
1,000
Input
On-
Current
(mA)
1.6
8-Pin DIP (300 Mil)
Single
Dual
Channel
Channel
Package
Package
HCPL-2200
[1,2]
HCPL-2201
HCPL-2202
HCPL-2231
HCPL-2219
[1,2]
HCPL-2211
HCPL-2212
HCPL-2232
wide V
CC
range allow compatibil-
ity with TTL, LSTTL, and CMOS
logic and result in lower power
consumption compared to other
high speed couplers. Logic signals
are transmitted with a typical
propagation delay of 150 ns.
Hermetic
Single and
Dual Channel
Packages
V
CM
(V)
50
Small-
Widebody
Outline SO-8 (400 Mil)
Single
Single
Channel
Channel
Package
Package
HCPL-0201 HCNW2201
2,500
5,000
[3]
400
300
[3]
1.8
1.6
1.6
1.8
2.0
HCPL-0211
HCNW2211
1,000
50
HCPL-52XX
[2]
HCPL-62XX
[2]
Notes:
1. HCPL-2200/2219 devices include output enable/disable function.
2. Technical data for the HCPL-2200/2219, HCPL-52XX and HCPL-62XX are on separate Agilent publications.
3. Minimum CMR of 10 kV/µs with V
CM
= 1000 V can be achieved with input current, I
F
, of 5 mA.
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
HCPL-2211#XXXX
060 = IEC/EN/DIN EN 60747-5-2 V
IORM
= 630 V
peak
Option*
300 = Gull Wing Surface Mount Option**
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for information.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July 2001
and lead free option will use “-”
*For HCPL-2211/2212 only.
**Gull wing surface mount option applies to through hole parts only.
I
CC
8
1 I
F1
+
V
F1
–
2
SHIELD
V
O
I
O1
7
V
O1
V
CC
Schematic
I
CC
8
2 I
F
I
O
V
CC
+
V
F
–
3
SHIELD
HCPL-2201/02/11/12
HCPL-0201/11
HCNW2201/11
5
GND
3
–
V
F2
+
4 I
F2
SHIELD
HCPL-2231/32
I
O2
6
V
O2
5
GND
3
Package Outline Drawings
8-Pin DIP Package (HCPL-2201/02/11/12/31/32)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
OPTION CODE*
DATE CODE
A XXXXZ
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
* MARKING CODE LETTER FOR OPTION NUMBERS
"V" = OPTION 060
OPTION NUMBERS 300 AND 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
4
Small-Outline SO-8 Package (HCPL-0201/11)
LAND PATTERN RECOMMENDATION
8
7
6
5
3.937 ± 0.127
(0.155 ± 0.005)
XXX
YWW
5.994 ± 0.203
(0.236 ± 0.008)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
4
7.49 (0.295)
PIN ONE
1
0.406 ± 0.076
(0.016 ± 0.003)
2
3
1.9 (0.075)
1.270 BSC
(0.050)
0.64 (0.025)
*
5.080 ± 0.127
(0.200 ± 0.005)
7°
45° X
0.432
(0.017)
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
0.228 ± 0.025
(0.009 ± 0.001)
*
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.305 MIN.
(0.012)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
8-Pin Widebody DIP Package (HCNW2201/11)
11.00 MAX.
(0.433)
5
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
9.00 ± 0.15
(0.354 ± 0.006)
TYPE NUMBER
DATE CODE
A
HCNWXXXX
YYWW
1
2
3
4
1.55
(0.061)
MAX.
10.16 (0.400)
TYP.
7° TYP.
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
0.40 (0.016)
0.56 (0.022)
0.51 (0.021) MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
13.56
(0.534)
1
2
3
4
1.3
(0.051)
1.55
(0.061)
MAX.
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
2.29
(0.09)
4.00 MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
7° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
嵌入式系统
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