IC,ANALOG MUX,SINGLE,4-CHANNEL,CMOS,DIP,16PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
Reach Compliance Code | not_compliant |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
信道数量 | 4 |
功能数量 | 1 |
端子数量 | 16 |
最大通态电阻 (Ron) | 500 Ω |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5,+-15 V |
最大供电电流 (Isup) | 1 mA |
表面贴装 | NO |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
HI1-1828A-7 | HI1-1828A/883 | HI4P1818A-5 | HI3-1818A-5 | HI4-1828A/883 | HI1-1818A/883 | HI1-1828A-5 | |
---|---|---|---|---|---|---|---|
描述 | IC,ANALOG MUX,SINGLE,4-CHANNEL,CMOS,DIP,16PIN,CERAMIC | HI1-1828A/883 | IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,LDCC,20PIN,PLASTIC | HI3-1818A-5 | HI4-1828A/883 | 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16 | IC,ANALOG MUX,SINGLE,4-CHANNEL,CMOS,DIP,16PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | S-PQCC-J20 | R-PDIP-T16 | S-XQCC-N20 | R-GDIP-T16 | R-XDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
信道数量 | 4 | 4 | 8 | 8 | 4 | 8 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 20 | 16 | 20 | 16 | 16 |
最大通态电阻 (Ron) | 500 Ω | 500 Ω | 500 Ω | 500 Ω | 500 Ω | 400 Ω | 500 Ω |
最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC |
封装代码 | DIP | DIP | QCCJ | DIP | QCCN | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
最大供电电流 (Isup) | 1 mA | 0.5 mA | 1 mA | 1 mA | 0.5 mA | 0.5 mA | 1 mA |
表面贴装 | NO | NO | YES | NO | YES | NO | NO |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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