Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | PGA |
包装说明 | PGA, |
针数 | 68 |
Reach Compliance Code | unknown |
地址总线宽度 | 20 |
位大小 | 16 |
边界扫描 | NO |
最大时钟频率 | 16 MHz |
外部数据总线宽度 | 16 |
格式 | FIXED POINT |
集成缓存 | NO |
JESD-30 代码 | S-CPGA-P68 |
JESD-609代码 | e0 |
长度 | 29.464 mm |
低功率模式 | NO |
端子数量 | 68 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 5.21 mm |
速度 | 8 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | PIN/PEG |
端子节距 | 2.54 mm |
端子位置 | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 29.464 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
A80186 | R80186 | QR80186 | QR80188 | N80186 | TA80186 | QA80186 | TA80188 | |
---|---|---|---|---|---|---|---|---|
描述 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 | 16-BIT, 8MHz, MICROPROCESSOR, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, PQCC68, PLASTIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 | 16-BIT, 8MHz, MICROPROCESSOR, CPGA68, CERAMIC, PGA-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 |
是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | PGA | LCC | LCC | LCC | LCC | PGA | PGA | PGA |
包装说明 | PGA, | QCCN, | CERAMIC, LCC-68 | QCCN, | QCCJ, | PGA, | CERAMIC, PGA-68 | PGA, |
针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
地址总线宽度 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
外部数据总线宽度 | 16 | 16 | 16 | 8 | 16 | 16 | 16 | 8 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-CPGA-P68 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | S-PQCC-J68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 29.464 mm | 24.13 mm | 24.13 mm | 24.13 mm | 24.2316 mm | 29.464 mm | 29.464 mm | 29.464 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | PGA | QCCN | QCCN | QCCN | QCCJ | PGA | PGA | PGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified |
座面最大高度 | 5.21 mm | 3.68 mm | 3.68 mm | 3.68 mm | 4.83 mm | 5.21 mm | 5.21 mm | 5.21 mm |
速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES | NO | NO | NO |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | PIN/PEG | NO LEAD | NO LEAD | NO LEAD | J BEND | PIN/PEG | PIN/PEG | PIN/PEG |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | PERPENDICULAR | QUAD | QUAD | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 29.464 mm | 24.13 mm | 24.13 mm | 24.13 mm | 24.2316 mm | 29.464 mm | 29.464 mm | 29.464 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | - | CMOS |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved