16-BIT, 8MHz, MICROPROCESSOR, CQCC68, CERAMIC, LCC-68
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | LCC |
| 包装说明 | CERAMIC, LCC-68 |
| 针数 | 68 |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 20 |
| 位大小 | 16 |
| 边界扫描 | NO |
| 最大时钟频率 | 16 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| JESD-30 代码 | S-CQCC-N68 |
| JESD-609代码 | e0 |
| 长度 | 24.13 mm |
| 低功率模式 | NO |
| 端子数量 | 68 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 3.68 mm |
| 速度 | 8 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 24.13 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR |
| QR80186 | R80186 | QR80188 | N80186 | A80186 | TA80186 | QA80186 | TA80188 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 16-BIT, 8MHz, MICROPROCESSOR, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CQCC68, CERAMIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, PQCC68, PLASTIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 | 16-BIT, 8MHz, MICROPROCESSOR, CPGA68, CERAMIC, PGA-68 | Microprocessor, 16-Bit, 8MHz, CMOS, CPGA68, CERAMIC, PGA-68 |
| 是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | LCC | LCC | LCC | LCC | PGA | PGA | PGA | PGA |
| 包装说明 | CERAMIC, LCC-68 | QCCN, | QCCN, | QCCJ, | PGA, | PGA, | CERAMIC, PGA-68 | PGA, |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 地址总线宽度 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| 外部数据总线宽度 | 16 | 16 | 8 | 16 | 16 | 16 | 16 | 8 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 | S-PQCC-J68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 24.13 mm | 24.13 mm | 24.13 mm | 24.2316 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | QCCN | QCCJ | PGA | PGA | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | COMMERCIAL | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified |
| 座面最大高度 | 3.68 mm | 3.68 mm | 3.68 mm | 4.83 mm | 5.21 mm | 5.21 mm | 5.21 mm | 5.21 mm |
| 速度 | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz | 8 MHz |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | NO | NO | NO | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | J BEND | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 24.13 mm | 24.13 mm | 24.13 mm | 24.2316 mm | 29.464 mm | 29.464 mm | 29.464 mm | 29.464 mm |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR | MICROPROCESSOR |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
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