256KX8 OTPROM, 200ns, XMA68
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | , CARD68 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| 备用内存宽度 | 16 |
| I/O 类型 | COMMON |
| JESD-30 代码 | X-XXMA-X68 |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 55 °C |
| 最低工作温度 | |
| 组织 | 256KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装等效代码 | CARD68 |
| 封装形状 | UNSPECIFIED |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.002 A |
| 最大压摆率 | 0.1 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | UNSPECIFIED |
| 端子位置 | UNSPECIFIED |
| CMS68P256N-200 | CMS68P256-200 | CMS68P1MB-200 | CMS68P1MBN-200 | CMS68P512-200 | CMS68P512N-200 | |
|---|---|---|---|---|---|---|
| 描述 | 256KX8 OTPROM, 200ns, XMA68 | IC 256K X 8 OTPROM, 200 ns, XMA68, Programmable ROM | 1MX8 OTPROM, 200ns, XMA68 | 1MX8 OTPROM, 200ns, XMA68 | 512KX8 OTPROM, 200ns, XMA68 | 512KX8 OTPROM, 200ns, XMA68 |
| 包装说明 | , CARD68 | , CARD68 | , CARD68 | , CARD68 | , CARD68 | , CARD68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | X-XXMA-X68 | X-XXMA-X68 | X-XXMA-X68 | X-XXMA-X68 | X-XXMA-X68 | X-XXMA-X68 |
| 内存密度 | 2097152 bit | 2097152 bit | 8388608 bit | 8388608 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 262144 words | 262144 words | 1048576 words | 1048576 words | 524288 words | 524288 words |
| 字数代码 | 256000 | 256000 | 1000000 | 1000000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 55 °C | 55 °C | 55 °C | 55 °C | 55 °C | 55 °C |
| 组织 | 256KX8 | 256KX8 | 1MX8 | 1MX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装等效代码 | CARD68 | CARD68 | CARD68 | CARD68 | CARD68 | CARD68 |
| 封装形状 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| 最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 端子位置 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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