8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 具有ADC | NO |
| 其他特性 | ALSO OPERATES AT 5V SUPPLY |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 4.2 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQCC-J44 |
| 长度 | 16.585 mm |
| I/O 线路数量 | 24 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 4.57 mm |
| 速度 | 2.1 MHz |
| 最大供电电压 | 2.42 V |
| 最小供电电压 | 1.98 V |
| 标称供电电压 | 2.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 16.585 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| MC68HC05RC16FN | MC68HC05RC16P | MC68HC05RC8FN | MC68HC05RC8P | MC68HC05RC16DW | |
|---|---|---|---|---|---|
| 描述 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44 | IC,MICROCONTROLLER,8-BIT,6805 CPU,CMOS,DIP,28PIN,PLASTIC | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PQCC44, PLASTIC, LCC-44 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP28, PLASTIC, DIP-28 | 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDSO28, SOIC-28 |
| 零件包装代码 | LCC | DIP | LCC | DIP | SOIC |
| 包装说明 | QCCJ, | DIP, | QCCJ, | DIP, | SOP, |
| 针数 | 44 | 28 | 44 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | NO | NO | NO | NO | NO |
| 其他特性 | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz | 4.2 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-PQCC-J44 | R-PDIP-T28 | S-PQCC-J44 | R-PDIP-T28 | R-PDSO-G28 |
| 长度 | 16.585 mm | 36.83 mm | 16.585 mm | 36.83 mm | 17.925 mm |
| I/O 线路数量 | 24 | 20 | 24 | 20 | 20 |
| 端子数量 | 44 | 28 | 44 | 28 | 28 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| PWM 通道 | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | DIP | QCCJ | DIP | SOP |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 4.57 mm | 5.08 mm | 4.57 mm | 5.08 mm | 2.65 mm |
| 速度 | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz | 2.1 MHz |
| 最大供电电压 | 2.42 V | 2.42 V | 2.42 V | 2.42 V | 2.42 V |
| 最小供电电压 | 1.98 V | 1.98 V | 1.98 V | 1.98 V | 1.98 V |
| 标称供电电压 | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| 表面贴装 | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 16.585 mm | 15.24 mm | 16.585 mm | 15.24 mm | 7.5 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| ECCN代码 | EAR99 | - | EAR99 | - | EAR99 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved