1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, UUC, DIE
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DIE, |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | TWO TERMINAL VOLTAGE REFERENCE |
JESD-30 代码 | X-XUUC-N |
湿度敏感等级 | 1 |
功能数量 | 1 |
输出次数 | 1 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
最大输出电压 | 1.232 V |
最小输出电压 | 1.21 V |
标称输出电压 | 1.22 V |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | UNSPECIFIED |
封装形式 | UNCASED CHIP |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子形式 | NO LEAD |
端子位置 | UPPER |
处于峰值回流温度下的最长时间 | 40 |
微调/可调输出 | NO |
LM113MDS | LM113GMW8 | LM313H/NOPB | LM113WG-QML | LM113WG-MPR | |
---|---|---|---|---|---|
描述 | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, UUC, DIE | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, UUC, WAFER | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, MBCY2, METAL CAN, TO-46, 2 PIN | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, CDSO10, CERAMIC, SOIC-10 | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.22V, CDSO10, CERAMIC, SOIC-10 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | DIE, | DIE, | , | SOP, | SOP, |
Reach Compliance Code | compliant | unknown | compliant | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE |
JESD-30 代码 | X-XUUC-N | X-XUUC-N | O-MBCY-W2 | R-GDSO-G10 | R-GDSO-G10 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
输出次数 | 1 | 1 | 1 | 1 | 1 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C |
最大输出电压 | 1.232 V | 1.232 V | 1.28 V | 1.232 V | 1.232 V |
最小输出电压 | 1.21 V | 1.21 V | 1.16 V | 1.21 V | 1.21 V |
标称输出电压 | 1.22 V | 1.22 V | 1.22 V | 1.22 V | 1.22 V |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装形状 | UNSPECIFIED | UNSPECIFIED | ROUND | RECTANGULAR | RECTANGULAR |
封装形式 | UNCASED CHIP | UNCASED CHIP | CYLINDRICAL | SMALL OUTLINE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | NO | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
端子形式 | NO LEAD | NO LEAD | WIRE | GULL WING | GULL WING |
端子位置 | UPPER | UPPER | BOTTOM | DUAL | DUAL |
微调/可调输出 | NO | NO | NO | NO | NO |
封装代码 | DIE | DIE | - | SOP | SOP |
端子数量 | - | - | 2 | 10 | 10 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved