Power Supply Support Circuit, Fixed, 1 Channel, BIPolar, PDIP8, PACKAGE-8
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 8 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDIP-T8 |
JESD-609代码 | e0 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
最大供电电压 (Vsup) | 30 V |
最小供电电压 (Vsup) | 2.2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
ICL8211CPA | ICL8211MTY | ICL8211MTY/883B | ICL8212CBA | ICL8212MTY/883B | |
---|---|---|---|---|---|
描述 | Power Supply Support Circuit, Fixed, 1 Channel, BIPolar, PDIP8, PACKAGE-8 | Power Supply Support Circuit, Fixed, 1 Channel, BIPolar, MBCY8, PACKAGE-8 | Power Supply Support Circuit, Fixed, 1 Channel, BIPolar, MBCY8, PACKAGE-8 | Power Supply Support Circuit, Fixed, 1 Channel, BIPolar, PDSO8, PACKAGE-8 | Power Supply Support Circuit, Fixed, 1 Channel, BIPolar, MBCY8, PACKAGE-8 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | DIP | BCY | BCY | SOIC | BCY |
针数 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
可调阈值 | NO | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDIP-T8 | O-MBCY-W8 | O-MBCY-W8 | R-PDSO-G8 | O-MBCY-W8 |
信道数量 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | - | -55 °C |
封装主体材料 | PLASTIC/EPOXY | METAL | METAL | PLASTIC/EPOXY | METAL |
封装形状 | RECTANGULAR | ROUND | ROUND | RECTANGULAR | ROUND |
封装形式 | IN-LINE | CYLINDRICAL | CYLINDRICAL | SMALL OUTLINE | CYLINDRICAL |
最大供电电压 (Vsup) | 30 V | 30 V | 30 V | 30 V | 30 V |
最小供电电压 (Vsup) | 2.2 V | 2.8 V | 2.8 V | 2.2 V | 2.8 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | WIRE | WIRE | GULL WING | WIRE |
端子位置 | DUAL | BOTTOM | BOTTOM | DUAL | BOTTOM |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - |
JESD-609代码 | e0 | e0 | e0 | e0 | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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