Flash, 64KX8, 200ns, PQCC32, PLASTIC, LCC-32
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | QFJ |
包装说明 | PLASTIC, LCC-32 |
针数 | 32 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
最长访问时间 | 200 ns |
其他特性 | AUTOMATIC WRITE |
JESD-30 代码 | R-PQCC-J32 |
JESD-609代码 | e3 |
长度 | 13.97 mm |
内存密度 | 524288 bi |
内存集成电路类型 | FLASH |
内存宽度 | 8 |
湿度敏感等级 | 2 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 245 |
编程电压 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.55 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | MATTE TIN |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
类型 | NOR TYPE |
宽度 | 11.43 mm |
Base Number Matches | 1 |
AT29C512-20JUT/R | AT29C512-20JCT/R | AT29C512-20JIT/R | AT29C512-20TC | AT29C512-20TCT/R | AT29C512-20TI | AT29C512-20TIT/R | AT29C512-20TU | AT29C512-20TUT/R | |
---|---|---|---|---|---|---|---|---|---|
描述 | Flash, 64KX8, 200ns, PQCC32, PLASTIC, LCC-32 | Flash, 64KX8, 200ns, PQCC32, PLASTIC, LCC-32 | Flash, 64KX8, 200ns, PQCC32, PLASTIC, LCC-32 | Flash, 64KX8, 200ns, PDSO32, PLASTIC, TSOP-32 | Flash, 64KX8, 200ns, PDSO32, PLASTIC, TSOP-32 | Flash, 64KX8, 200ns, PDSO32, PLASTIC, TSOP-32 | Flash, 64KX8, 200ns, PDSO32, PLASTIC, TSOP-32 | Flash, 64KX8, 200ns, PDSO32, PLASTIC, TSOP-32 | Flash, 64KX8, 200ns, PDSO32, PLASTIC, TSOP-32 |
是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 |
零件包装代码 | QFJ | QFJ | QFJ | TSOP | TSOP | TSOP | TSOP | TSOP | TSOP |
包装说明 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, TSOP-32 | PLASTIC, TSOP-32 | PLASTIC, TSOP-32 | PLASTIC, TSOP-32 | PLASTIC, TSOP-32 | PLASTIC, TSOP-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | compli | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns | 200 ns |
其他特性 | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE | AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION | AUTOMATIC WRITE |
JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609代码 | e3 | e0 | e0 | e0 | e0 | e0 | e0 | e3 | e3 |
长度 | 13.97 mm | 13.97 mm | 13.97 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm |
内存密度 | 524288 bi | 524288 bi | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 2 | 2 | 2 | 3 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 245 | 225 | 225 | 240 | 240 | 240 | 240 | 260 | 260 |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.55 mm | 3.55 mm | 3.55 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | MATTE TIN | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | MATTE TIN | MATTE TIN |
端子形式 | J BEND | J BEND | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 11.43 mm | 11.43 mm | 11.43 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
厂商名称 | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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