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74AUP1T57GM,132

产品描述Low-power configurable gate with voltage-level translator
产品类别逻辑    逻辑   
文件大小211KB,共20页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AUP1T57GM,132概述

Low-power configurable gate with voltage-level translator

74AUP1T57GM,132规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SON
包装说明1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
针数6
制造商包装代码SOT886
Reach Compliance Codecompli
系列AUP/ULP/V
JESD-30 代码R-PDSO-N6
JESD-609代码e3
长度1.45 mm
负载电容(CL)30 pF
逻辑集成电路类型MAJORITY LOGIC GATE
最大I(ol)0.0027 A
湿度敏感等级1
功能数量1
输入次数3
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码VSON
封装等效代码SOLCC6,.04,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, VERY THIN PROFILE
包装方法TAPE AND REEL
峰值回流温度(摄氏度)260
电源2.5/3.3 V
Prop。Delay @ Nom-Su11.9 ns
传播延迟(tpd)11.9 ns
认证状态Not Qualified
施密特触发器YES
座面最大高度0.5 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.3 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Tin (Sn)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度1 mm

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74AUP1T57
Low-power configurable gate with voltage-level translator
Rev. 5 — 15 August 2012
Product data sheet
1. General description
The 74AUP1T57 provides low-power, low-voltage configurable logic gate functions. The
output state is determined by eight patterns of 3-bit input. The user can choose the logic
functions AND, OR, NAND, NOR, XNOR, inverter and buffer. All inputs can be connected
to V
CC
or GND.
This device ensures a very low static and dynamic power consumption across the entire
V
CC
range from 2.3 V to 3.6 V.
The 74AUP1T57 is designed for logic-level translation applications with input switching
levels that accept 1.8 V low-voltage CMOS signals, while operating from either a single
2.5 V or 3.3 V supply voltage.
The wide supply voltage range ensures normal operation as battery voltage drops from
3.6 V to 2.3 V.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing the damaging backflow current through the device
when it is powered down.
Schmitt trigger inputs make the circuit tolerant to slower input rise and fall times across
the entire V
CC
range.
2. Features and benefits
Wide supply voltage range from 2.3 V to 3.6 V
High noise immunity
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; I
CC
= 1.5
A
(maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of V
CC
I
OFF
circuitry provides partial power-down mode operation
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C

74AUP1T57GM,132相似产品对比

74AUP1T57GM,132 74AUP1T57GF,132 74AUP1T57GS,132
描述 Low-power configurable gate with voltage-level translator Low-power configurable gate with voltage-level translator Low-power configurable gate with voltage-level translator
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc
是否Rohs认证 符合 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, XSON-6 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6
制造商包装代码 SOT886 SOT891 SOT1202
Reach Compliance Code compli compli compli
零件包装代码 SON SON -
针数 6 6 -
系列 AUP/ULP/V AUP/ULP/V -
JESD-30 代码 R-PDSO-N6 S-PDSO-N6 -
JESD-609代码 e3 e3 -
长度 1.45 mm 1 mm -
负载电容(CL) 30 pF 30 pF -
逻辑集成电路类型 MAJORITY LOGIC GATE MAJORITY LOGIC GATE -
最大I(ol) 0.0027 A 0.0027 A -
湿度敏感等级 1 1 -
功能数量 1 1 -
输入次数 3 3 -
端子数量 6 6 -
最高工作温度 125 °C 125 °C -
最低工作温度 -40 °C -40 °C -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 VSON VSON -
封装等效代码 SOLCC6,.04,20 SOLCC6,.04,14 -
封装形状 RECTANGULAR SQUARE -
封装形式 SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE -
包装方法 TAPE AND REEL TAPE AND REEL -
峰值回流温度(摄氏度) 260 260 -
电源 2.5/3.3 V 2.5/3.3 V -
Prop。Delay @ Nom-Su 11.9 ns 11.9 ns -
传播延迟(tpd) 11.9 ns 11.9 ns -
认证状态 Not Qualified Not Qualified -
施密特触发器 YES YES -
座面最大高度 0.5 mm 0.5 mm -
最大供电电压 (Vsup) 3.6 V 3.6 V -
最小供电电压 (Vsup) 2.3 V 2.3 V -
标称供电电压 (Vsup) 2.5 V 2.5 V -
表面贴装 YES YES -
技术 CMOS CMOS -
温度等级 AUTOMOTIVE AUTOMOTIVE -
端子面层 Tin (Sn) Tin (Sn) -
端子形式 NO LEAD NO LEAD -
端子节距 0.5 mm 0.35 mm -
端子位置 DUAL DUAL -
处于峰值回流温度下的最长时间 30 30 -
宽度 1 mm 1 mm -

 
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