HC/UH SERIES, 2-INPUT AND GATE, PDSO5
HC/UH系列, 2输入 与门, PDSO5
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-10-15 00:00:00 |
| Brand Name | NXP Semiconduc |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 |
| 针数 | 5 |
| 制造商包装代码 | SOT353-1 |
| Reach Compliance Code | unknow |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e3 |
| 长度 | 2.05 mm |
| 逻辑集成电路类型 | AND GATE |
| 功能数量 | 1 |
| 输入次数 | 2 |
| 端子数量 | 5 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 16 ns |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 1.25 mm |
| 74AHC1G08GW/C,125 | 74AHC1G08GV,125 | 74AHC1G08GV/C,125 | 74AHC1G08GW,125 | 74AHC1G08GW,165 | |
|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, 2-INPUT AND GATE, PDSO5 | HC/UH SERIES, 2-INPUT AND GATE, PDSO5 | HC/UH SERIES, 2-INPUT AND GATE, PDSO5 | HC/UH SERIES, 2-INPUT AND GATE, PDSO5 | HC/UH SERIES, 2-INPUT AND GATE, PDSO5 |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | TSOP | TSOP | TSSOP | TSSOP |
| 包装说明 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 | PLASTIC, SC-74A, SOT-753, 5 PIN | PLASTIC, SC-74A, SOT-753, 5 PIN | TSSOP, TSSOP5/6,.08 | TSSOP, |
| 针数 | 5 | 5 | 5 | 5 | 5 |
| 制造商包装代码 | SOT353-1 | SOT753 | SOT753 | SOT353-1 | SOT353-1 |
| Reach Compliance Code | unknow | compli | unknow | compli | unknow |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 2.05 mm | 2.9 mm | 2.9 mm | 2.05 mm | 2.05 mm |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | TIN | Tin (Sn) | TIN | Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.95 mm | 0.95 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 1.25 mm | 1.5 mm | 1.5 mm | 1.25 mm | 1.25 mm |
| 是否Rohs认证 | - | 符合 | - | 符合 | 符合 |
| 湿度敏感等级 | - | 1 | - | 1 | 1 |
| 峰值回流温度（摄氏度） | - | 260 | - | 260 | 260 |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified |
| 处于峰值回流温度下的最长时间 | - | 30 | - | 30 | 30 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
