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74HC75PW,112

产品描述HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16
产品类别逻辑    逻辑   
文件大小94KB,共20页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74HC75PW,112概述

HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16

HC/UH系列, 高电平双触发D触发器, 互补输出, PDIP16

74HC75PW,112规格参数

参数名称属性值
Brand NameNXP Semiconduc
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码TSSOP
包装说明TSSOP, TSSOP16,.25
针数16
制造商包装代码SOT403-1
Reach Compliance Codecompli
系列HC/UH
JESD-30 代码R-PDSO-G16
JESD-609代码e4
长度5 mm
负载电容(CL)50 pF
逻辑集成电路类型D LATCH
最大I(ol)0.004 A
湿度敏感等级1
位数2
功能数量2
端子数量16
最高工作温度125 °C
最低工作温度-40 °C
输出极性COMPLEMENTARY
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP16,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源2/6 V
Prop。Delay @ Nom-Su36 ns
传播延迟(tpd)190 ns
认证状态Not Qualified
座面最大高度1.1 mm
最大供电电压 (Vsup)6 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
触发器类型HIGH LEVEL
宽度4.4 mm
最小 fmax60 MHz
Base Number Matches1

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74HC75
Quad bistable transparant latch
Rev. 03 — 12 November 2004
Product data sheet
1. General description
The 74HC75 is a high-speed Si-gate CMOS device and is pin compatible with low power
Schottky TTL (LSTTL). The 74HC75 is specified in compliance with JEDEC
standard no. 7A.
The 74HC75 has four bistable latches. The two latches are simultaneously controlled by
one of two active HIGH enable inputs (LE12 and LE34). When LEnn is HIGH, the data
enters the latches and appears at the nQ outputs. The nQ outputs follow the data inputs
(nD) as long as LEnn is HIGH (transparent). The data on the nD inputs one set-up time
prior to the HIGH-to-LOW transition of the LEnn will be stored in the latches. The latched
outputs remain stable as long as the LEnn is LOW.
2. Features
s
s
s
s
s
Complementary Q and Q outputs
V
CC
and GND on the center pins
Low-power dissipation
Complies with JEDEC standard no. 7A
ESD protection:
x
HBM EIA/JESD22-A114-B exceeds 2000 V
x
MM EIA/JESD22-A115-A exceeds 200 V.
s
Multiple package options
s
Specified from
−40 °C
to +80
°C
and from
−40 °C
to +125
°C.

74HC75PW,112相似产品对比

74HC75PW,112 74HC75PW,118 74HC75DB,112 74HC75 74HC75N
描述 HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16 HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16
系列 HC/UH HC/UH HC/UH HC/UH HC/UH
位数 2 2 2 2 2
功能数量 2 2 2 2 2
端子数量 16 16 16 16 16
输出极性 COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
表面贴装 YES YES YES Yes NO
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
端子位置 DUAL DUAL DUAL DUAL
触发器类型 HIGH LEVEL HIGH LEVEL HIGH LEVEL 高 LEVEL HIGH LEVEL
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc - -
是否Rohs认证 符合 符合 符合 - 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦)
零件包装代码 TSSOP TSSOP SSOP1 - DIP
包装说明 TSSOP, TSSOP16,.25 TSSOP, TSSOP16,.25 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 - DIP, DIP16,.3
针数 16 16 16 - 16
制造商包装代码 SOT403-1 SOT403-1 SOT338-1 - -
Reach Compliance Code compli compli compli - unknow
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 - R-PDIP-T16
JESD-609代码 e4 e4 e4 - e4
长度 5 mm 5 mm 6.2 mm - 19.025 mm
负载电容(CL) 50 pF 50 pF 50 pF - 50 pF
逻辑集成电路类型 D LATCH D LATCH D LATCH - D LATCH
最大I(ol) 0.004 A 0.004 A 0.004 A - 0.004 A
湿度敏感等级 1 1 1 - -
最高工作温度 125 °C 125 °C 125 °C - 125 °C
最低工作温度 -40 °C -40 °C -40 °C - -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 TSSOP TSSOP SSOP - DIP
封装等效代码 TSSOP16,.25 TSSOP16,.25 SSOP16,.3 - DIP16,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH - IN-LINE
峰值回流温度(摄氏度) 260 260 260 - NOT SPECIFIED
电源 2/6 V 2/6 V 2/6 V - 2/6 V
Prop。Delay @ Nom-Su 36 ns 36 ns 36 ns - 36 ns
传播延迟(tpd) 190 ns 190 ns 190 ns - 190 ns
认证状态 Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 1.1 mm 1.1 mm 2 mm - 4.2 mm
最大供电电压 (Vsup) 6 V 6 V 6 V - 6 V
最小供电电压 (Vsup) 2 V 2 V 2 V - 2 V
标称供电电压 (Vsup) 5 V 5 V 5 V - 5 V
技术 CMOS CMOS CMOS - CMOS
端子面层 Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - Nickel/Palladium/Gold (Ni/Pd/Au)
端子节距 0.65 mm 0.65 mm 0.65 mm - 2.54 mm
处于峰值回流温度下的最长时间 30 30 30 - NOT SPECIFIED
宽度 4.4 mm 4.4 mm 5.3 mm - 7.62 mm
最小 fmax 60 MHz 60 MHz 60 MHz - 60 MHz

 
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