HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16
HC/UH系列, 高电平双触发D触发器, 互补输出, PDIP16
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconduc |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP16,.25 |
| 针数 | 16 |
| 制造商包装代码 | SOT403-1 |
| Reach Compliance Code | compli |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | D LATCH |
| 最大I(ol) | 0.004 A |
| 湿度敏感等级 | 1 |
| 位数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Su | 36 ns |
| 传播延迟(tpd) | 190 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | HIGH LEVEL |
| 宽度 | 4.4 mm |
| 最小 fmax | 60 MHz |
| Base Number Matches | 1 |

| 74HC75PW,112 | 74HC75PW,118 | 74HC75DB,112 | 74HC75 | 74HC75N | |
|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDIP16 | HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL HIGH LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PDSO16 |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| 位数 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 表面贴装 | YES | YES | YES | Yes | NO |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | 双 | DUAL |
| 触发器类型 | HIGH LEVEL | HIGH LEVEL | HIGH LEVEL | 高 LEVEL | HIGH LEVEL |
| Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | TSSOP | TSSOP | SSOP1 | - | DIP |
| 包装说明 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.25 | 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16 | - | DIP, DIP16,.3 |
| 针数 | 16 | 16 | 16 | - | 16 |
| 制造商包装代码 | SOT403-1 | SOT403-1 | SOT338-1 | - | - |
| Reach Compliance Code | compli | compli | compli | - | unknow |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDIP-T16 |
| JESD-609代码 | e4 | e4 | e4 | - | e4 |
| 长度 | 5 mm | 5 mm | 6.2 mm | - | 19.025 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | D LATCH | D LATCH | D LATCH | - | D LATCH |
| 最大I(ol) | 0.004 A | 0.004 A | 0.004 A | - | 0.004 A |
| 湿度敏感等级 | 1 | 1 | 1 | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SSOP | - | DIP |
| 封装等效代码 | TSSOP16,.25 | TSSOP16,.25 | SSOP16,.3 | - | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | IN-LINE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | - | NOT SPECIFIED |
| 电源 | 2/6 V | 2/6 V | 2/6 V | - | 2/6 V |
| Prop。Delay @ Nom-Su | 36 ns | 36 ns | 36 ns | - | 36 ns |
| 传播延迟(tpd) | 190 ns | 190 ns | 190 ns | - | 190 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 2 mm | - | 4.2 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | - | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | - | 2.54 mm |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | - | NOT SPECIFIED |
| 宽度 | 4.4 mm | 4.4 mm | 5.3 mm | - | 7.62 mm |
| 最小 fmax | 60 MHz | 60 MHz | 60 MHz | - | 60 MHz |
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