IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| MM74HCT164J/A+ | MM74HCT164N/B+ | MM74HCT164M | MM74HCT164M/A+ | MM74HCT164N/A+ | MM54HCT164J/883 | MM54HCT164J/883B | MM54HCT164J/883C | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,PLASTIC | HCT SERIES, 8-BIT RIGHT SERIAL IN PARALLEL OUT SHIFT REGISTER, TRUE OUTPUT, PDSO14, PLASTIC, SO-14 | IC,SHIFT REGISTER,HCT-CMOS,SOP,14PIN,PLASTIC | IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,PLASTIC | IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,CERAMIC | IC,SHIFT REGISTER,HCT-CMOS,DIP,14PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | , | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| JESD-30 代码 | R-XDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T14 | - | R-XDIP-T14 | R-XDIP-T14 |
| 位数 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | - | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | SOP | SOP | DIP | - | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | - | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | NO | - | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
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