500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
500 mA, 50 V, NPN, 硅, 小信号晶体管, TO-236AB
参数名称 | 属性值 |
Brand Name | NXP Semiconduc |
是否Rohs认证 | 符合 |
零件包装代码 | TO-236 |
包装说明 | PLASTIC PACKAGE-3 |
针数 | 3 |
制造商包装代码 | SOT23 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
最大集电极电流 (IC) | 0.5 A |
集电极-发射极最大电压 | 50 V |
配置 | SINGLE |
最小直流电流增益 (hFE) | 120 |
JEDEC-95代码 | TO-236AB |
JESD-30 代码 | R-PDSO-G3 |
JESD-609代码 | e3 |
湿度敏感等级 | 1 |
元件数量 | 1 |
端子数量 | 3 |
最高工作温度 | 150 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
极性/信道类型 | NPN |
最大功率耗散 (Abs) | 0.25 W |
认证状态 | Not Qualified |
表面贴装 | YES |
端子面层 | Tin (Sn) |
端子形式 | GULL WING |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
标称过渡频率 (fT) | 160 MHz |
Base Number Matches | 1 |
2PD602ARL,235 | 2PD602AQL,215 | 2PD602AQL,235 | 2PD602ARL,215 | 2PD602ASL/DG,235 | 2PD602ASL/DG,215 | |
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描述 | 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 500 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB |
元件数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 3 | 3 | 3 | 3 | 3 | 3 |
表面贴装 | YES | YES | YES | YES | Yes | Yes |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Brand Name | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | - | - |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | - |
零件包装代码 | TO-236 | TO-236 | TO-236 | TO-236 | - | - |
包装说明 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | - | - |
针数 | 3 | 3 | 3 | 3 | - | - |
制造商包装代码 | SOT23 | SOT23 | SOT23 | SOT23 | - | - |
Reach Compliance Code | compli | compli | compli | compli | - | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | - |
最大集电极电流 (IC) | 0.5 A | 0.5 A | 0.5 A | 0.5 A | - | - |
集电极-发射极最大电压 | 50 V | 50 V | 50 V | 50 V | - | - |
配置 | SINGLE | SINGLE | SINGLE | SINGLE | - | - |
最小直流电流增益 (hFE) | 120 | 85 | 85 | 120 | - | - |
JEDEC-95代码 | TO-236AB | TO-236AB | TO-236AB | TO-236AB | - | - |
JESD-30 代码 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | - | - |
JESD-609代码 | e3 | e3 | e3 | e3 | - | - |
湿度敏感等级 | 1 | 1 | 1 | 1 | - | - |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | - |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | - | - |
极性/信道类型 | NPN | NPN | NPN | NPN | - | - |
最大功率耗散 (Abs) | 0.25 W | 0.25 W | 0.25 W | 0.25 W | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | - | - |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | - | - |
标称过渡频率 (fT) | 160 MHz | 140 MHz | 140 MHz | 160 MHz | - | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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