SEMiX302KD16s
Absolute Maximum Ratings
Symbol
I
FAV
I
FSM
i
2
t
Conditions
T
c
= 85 °C
T
c
= 100 °C
T
j
= 25 °C
T
j
= 130 °C
T
j
= 25 °C
T
j
= 130 °C
Values
300
240
8500
7500
361000
281000
1700
1600
-40 ... 130
-40 ... 125
Unit
A
A
A
A
A
2
s
A
2
s
V
V
°C
°C
V
V
Recitifier Diode
sin. 180°
10 ms
10 ms
SEMiX
®
2s
V
RSM
V
RRM
T
j
Module
Rectifier Diode Module
SEMiX302KD16s
T
stg
V
isol
AC sinus 50Hz
1 min
1s
4000
4800
Features
• Terminal height 17 mm
• Chips soldered directly to isolated
substrate
Characteristics
Symbol
Diode
V
F
V
(TO)
r
T
I
RD
R
th(j-c)
R
th(j-c)
Module
R
th(c-s)
M
s
M
t
a
w
250
per chip
per module
to heat sink (M5)
to terminals (M6)
3
2.5
0.045
5
5
5 * 9,81
K/W
K/W
Nm
Nm
m/s
2
g
T
j
= 25 °C, I
F
= 900 A
T
j
= 130 °C
T
j
= 130 °C
T
j
= 130 °C, V
RD
= V
RRM
per diode
per diode
0.091
1.6
0.85
1.1
15
V
V
mΩ
mA
K/W
K/W
sin. 180
K/W
K/W
Conditions
min.
typ.
max.
Unit
Typical Applications*
• Input Bridge Rectifier for AC/DC motor
control
• Power supply
KD
© by SEMIKRON
Rev. 26 – 25.03.2010
1
SEMiX302KD16s
Fig. 1L: Power dissipation per thyristor/diode vs.
on-state current
Fig. 1R: Power dissipation per thyristor/diode vs.
ambient temperature
Fig. 3L: Power dissipation of two modules vs. direct
current
Fig. 3R: Power dissipation of two modules vs. case
temperature
2
Rev. 26 – 25.03.2010
© by SEMIKRON
SEMiX302KD16s
Fig. 4L: Power dissipation of three modules vs. direct
current
Fig. 4R: Power dissipation of three modules vs. case
temperature
Fig. 6: Transient thermal impedance vs. time
Fig. 7: On-state characteristics
Fig. 8: Surge overload current vs. time
© by SEMIKRON
Rev. 26 – 25.03.2010
3
SEMiX302KD16s
spring configuration
SEMiX 2s
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
4
Rev. 26 – 25.03.2010
© by SEMIKRON
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