电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MASW-001100-1190

产品描述HMIC Silicon PIN Diode Switches
产品类别无线/射频/通信    射频和微波   
文件大小342KB,共10页
制造商MACOM
官网地址http://www.macom.com
下载文档 详细参数 全文预览

MASW-001100-1190概述

HMIC Silicon PIN Diode Switches

MASW-001100-1190规格参数

参数名称属性值
厂商名称MACOM
Reach Compliance Codecompli
其他特性USABLE TO 26.5 GHZ
构造COMPONENT
最大输入功率 (CW)33.01 dBm
最大插入损耗1.2 dB
最大工作频率20000 MHz
最小工作频率6000 MHz
最高工作温度125 °C
最低工作温度-65 °C
射频/微波设备类型SPST

文档预览

下载PDF文档
MASW-001100-1190
MASW-002100-1191
MASW-003100-1192
HMIC™ Silicon PIN Diode Switches
Features
Broad Bandwidth
Specified from 50MHz to 20GHz
Usable from 50MHz to 26.5GHz
Lower Insertion Loss / Higher Isolation
than pHempt
Rugged
Fully Monolithic,
Glass Encapsulated Construction
Up to +33dBm C.W. Power Handling
RoHS Compliant
V6
MASW-001100-1190
Description
The MASW-001100-1190, MASW-002100-1191 and
MASW-003100-1192 are broadband monolithic
switches using series and shunt connected silicon
PIN diodes. They are designed for use as 2W, high
performance switches in applications up to 26.5GHz.
They provide performance levels superior to those
realized by hybrid MIC designs incorporating
beamlead and PIN chip diodes that require chip and
wire assembly.
These switches are fabricated using M/A-COM’s
patented HMIC
TM
(Heterolithic Microwave Integrated
Circuit) process, US Patent 5,268,310. This process
allows the incorporation of silicon pedestals that
form series and shunt diodes or vias by imbedding
them in low loss, low dispersion glass. By using
small spacing between elements, this combination of
silicon and glass gives HMIC devices low loss and
high isolation performance through low
millimeter frequencies.
Large bond pads facilitate the use of low inductance
ribbon leads, while gold backside metallization
allows for manual or automatic chip bonding via
80/20, AuSn solder or conductive Ag epoxy.
Parameter
Operating Temperature
Storage Temperature
Junction Temperature
Applied Reverse Voltage
RF C.W. Incident Power
Bias Current +25°C
Absolute Maximum
-65
o
C to +125
o
C
-65
o
C to +150
o
C
+175
o
C
| - 50V |
+33dBm C.W.
±20mA
MASW-002100-1191
MASW-003100-1192
1
Max operating Conditions for a Combination of
RF Power, D.C. Bias and Temperature:
+33dBm CW @ 15mA (per diode) @+85°C
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
North America
Tel: 800.366.2266 •
Europe
Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
India
Tel: +91.80.43537383
China
Tel: +86.21.2407.1588
and/or prototype measurements. Commitment to develop is not guaranteed.
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 773  565  2396  1424  43  31  21  12  54  30 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved