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Datasheet> 器件分类 > 无线/射频/通信> 电信电路> TCM320AC56IDW

TCM320AC56IDW: 产品描述Baseband Circuit, CMOS, PDSO20, PLASTIC, SO-20; 产品类别无线/射频/通信电信电路; 文件大小330KB，共23页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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TCM320AC56IDW概述

Baseband Circuit, CMOS, PDSO20, PLASTIC, SO-20

TCM320AC56IDW规格参数

参数名称	属性值
厂商名称	Rochester Electronics
包装说明	SOP,
Reach Compliance Code	unknown
JESD-30 代码	R-PDSO-G20
JESD-609代码	e0
长度	12.8 mm
功能数量	1
端子数量	20
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
座面最大高度	2.65 mm
标称供电电压	5 V
表面贴装	YES
技术	CMOS
电信集成电路类型	BASEBAND CIRCUIT
温度等级	INDUSTRIAL
端子面层	TIN LEAD
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
宽度	7.5 mm

TCM320AC56IDW相似产品对比

	TCM320AC56IDW	TCM320AC56IPT	TCM320AC56IN	TCM320AC56CPT	TCM320AC57CPT	TCM320AC57CN	TCM320AC57IN	TCM320AC57IDW	TCM320AC57IPT
描述	Baseband Circuit, CMOS, PDSO20, PLASTIC, SO-20	Baseband Circuit, CMOS, PQFP48, PLASTIC, QFP-48	Baseband Circuit, CMOS, PDIP20, PLASTIC, DIP-20	Baseband Circuit, CMOS, PQFP48, PLASTIC, QFP-48	Baseband Circuit, CMOS, PQFP48, PLASTIC, QFP-48	Baseband Circuit, CMOS, PDIP20, PLASTIC, DIP-20	Baseband Circuit, CMOS, PDIP20, PLASTIC, DIP-20	Baseband Circuit, CMOS, PDSO20, PLASTIC, SO-20	Baseband Circuit, CMOS, PQFP48, PLASTIC, QFP-48
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
包装说明	SOP,	LFQFP,	DIP,	LFQFP,	LFQFP,	DIP,	DIP,	SOP,	LFQFP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-PDSO-G20	S-PQFP-G48	R-PDIP-T20	S-PQFP-G48	S-PQFP-G48	R-PDIP-T20	R-PDIP-T20	R-PDSO-G20	S-PQFP-G48
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	12.8 mm	7 mm	24.325 mm	7 mm	7 mm	24.325 mm	24.325 mm	12.8 mm	7 mm
功能数量	1	1	1	1	1	1	1	1	1
端子数量	20	48	20	48	48	20	20	20	48
最高工作温度	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-	-	-	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	LFQFP	DIP	LFQFP	LFQFP	DIP	DIP	SOP	LFQFP
封装形状	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	SMALL OUTLINE	FLATPACK, LOW PROFILE, FINE PITCH	IN-LINE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	IN-LINE	IN-LINE	SMALL OUTLINE	FLATPACK, LOW PROFILE, FINE PITCH
座面最大高度	2.65 mm	1.6 mm	5.08 mm	1.6 mm	1.6 mm	5.08 mm	5.08 mm	2.65 mm	1.6 mm
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	YES	YES	NO	NO	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
电信集成电路类型	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT	BASEBAND CIRCUIT
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD
端子形式	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING
端子节距	1.27 mm	0.5 mm	2.54 mm	0.5 mm	0.5 mm	2.54 mm	2.54 mm	1.27 mm	0.5 mm
端子位置	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL	DUAL	DUAL	QUAD
宽度	7.5 mm	7 mm	7.62 mm	7 mm	7 mm	7.62 mm	7.62 mm	7.5 mm	7 mm

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