Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | DFN |
包装说明 | HVSON, |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR |
控制技术 | PULSE WIDTH MODULATION |
最大输入电压 | 3.6 V |
最小输入电压 | 0.7 V |
标称输入电压 | 1.5 V |
JESD-30 代码 | S-XDSO-N8 |
JESD-609代码 | e0 |
长度 | 3 mm |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | HVSON |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 0.8 mm |
表面贴装 | YES |
切换器配置 | BOOST |
技术 | BICMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
MAX1947ETA27 | MAX1947ETA32 | MAX1947ETA26 | MAX1947ETA21 | MAX1947ETA23 | MAX1947ETA24 | MAX1947ETA19 | MAX1947ETA29 | MAX1947ETA22 | |
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描述 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 | Switching Regulator, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO229/WEEC, EXPOSED PAD, TDFN-8 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DFN | DFN | DFN | DFN | DFN | DFN | DFN | DFN | DFN |
包装说明 | HVSON, | HVSON, | HVSON, | HVSON, | HVSON, | HVSON, | HVSON, | HVSON, | HVSON, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
模拟集成电路 - 其他类型 | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR |
控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
最大输入电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小输入电压 | 0.7 V | 0.7 V | 0.7 V | 0.7 V | 0.7 V | 0.7 V | 0.7 V | 0.7 V | 0.7 V |
标称输入电压 | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
JESD-30 代码 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 | S-XDSO-N8 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON | HVSON |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
切换器配置 | BOOST | BOOST | BOOST | BOOST | BOOST | BOOST | BOOST | BOOST | BOOST |
技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
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