Memory IC
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknow |
| Base Number Matches | 1 |
| SCM23C256E-3 | SCM23C256E-2 | 883/23C256MC | 883/23C256MD | SCM23C256C-1 | SCM23C256C-2 | SCM23C256C-3 | SCM23C256E-1 | SCM23C256MC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Memory IC | Memory IC | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 100ns, CMOS, CDIP28 | MASK ROM, 32KX8, 120ns, CMOS, CDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 | MASK ROM, 32KX8, 100ns, CMOS, PDIP28 | MASK ROM, 32KX8, 150ns, CMOS, CDIP28 |
| 包装说明 | , | , | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | DIP, DIP28,.6 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | - | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) |
| 最长访问时间 | - | - | 150 ns | 150 ns | 100 ns | 120 ns | 150 ns | 100 ns | 150 ns |
| JESD-30 代码 | - | - | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | R-XDIP-T28 |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | - | - | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi | 262144 bi |
| 内存集成电路类型 | - | - | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | - | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | - | - | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | - | - | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | - | - | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 最高工作温度 | - | - | 125 °C | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C | 125 °C |
| 组织 | - | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | - | - | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | - | - | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | - | - | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 | DIP28,.6 |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | - | - | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| 最大压摆率 | - | - | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| 标称供电电压 (Vsup) | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | - | NO | NO | NO | NO | NO | NO | NO |
| 技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | MILITARY |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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