In-System Programmable 3.3V SuperWIDE鈩?High Density PLD
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Lattice(莱迪斯) |
零件包装代码 | QFP |
包装说明 | PLASTIC, QFP-208 |
针数 | 208 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
其他特性 | YES |
最大时钟频率 | 87 MHz |
系统内可编程 | YES |
JESD-30 代码 | S-PQFP-G208 |
JESD-609代码 | e0 |
JTAG BST | YES |
长度 | 28 mm |
湿度敏感等级 | 3 |
专用输入次数 | |
I/O 线路数量 | 144 |
宏单元数 | 256 |
端子数量 | 208 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 0 DEDICATED INPUTS, 144 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FQFP |
封装等效代码 | QFP208,1.2SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, FINE PITCH |
电源 | 2.5/3.3,3.3 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 9.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 28 mm |
ISPLSI5256V-125LQ208 | 5256V | ISPLSI5256V-100LB208 | ISPLSI5256V-100LQ208 | ISPLSI5256V-70LQ208 | ISPLSI5256V-125LB272 | ISPLSI5256V-70LB208 | ISPLSI5256V-100LB272 | ISPLSI5256V-125LB208 | ISPLSI5256V-70LB272 | |
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描述 | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD | In-System Programmable 3.3V SuperWIDE鈩?High Density PLD |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Lattice(莱迪斯) | - | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
零件包装代码 | QFP | - | BGA | QFP | QFP | BGA | BGA | BGA | BGA | BGA |
包装说明 | PLASTIC, QFP-208 | - | 1 MM PITCH, FBGA-208 | PLASTIC, QFP-208 | PLASTIC, QFP-208 | BGA-272 | 1 MM PITCH, FBGA-208 | BGA-272 | 1 MM PITCH, FBGA-208 | BGA-272 |
针数 | 208 | - | 208 | 208 | 208 | 272 | 208 | 272 | 208 | 272 |
Reach Compliance Code | compli | - | unknow | compli | compli | unknow | unknow | unknow | unknow | unknow |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 87 MHz | - | 64.5 MHz | 64.5 MHz | 43.5 MHz | 87 MHz | 43.5 MHz | 64.5 MHz | 87 MHz | 43.5 MHz |
系统内可编程 | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PQFP-G208 | - | S-PBGA-B208 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B272 | S-PBGA-B208 | S-PBGA-B272 | S-PBGA-B208 | S-PBGA-B272 |
JTAG BST | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
长度 | 28 mm | - | 17 mm | 28 mm | 28 mm | 27 mm | 17 mm | 27 mm | 17 mm | 27 mm |
湿度敏感等级 | 3 | - | 3 | 3 | 3 | - | 3 | - | 3 | - |
I/O 线路数量 | 144 | - | 144 | 144 | 144 | 192 | 144 | 192 | 144 | 192 |
宏单元数 | 256 | - | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
端子数量 | 208 | - | 208 | 208 | 208 | 272 | 208 | 272 | 208 | 272 |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 0 DEDICATED INPUTS, 144 I/O | - | 0 DEDICATED INPUTS, 144 I/O | 0 DEDICATED INPUTS, 144 I/O | 0 DEDICATED INPUTS, 144 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 144 I/O | 0 DEDICATED INPUTS, 192 I/O | 0 DEDICATED INPUTS, 144 I/O | 0 DEDICATED INPUTS, 192 I/O |
输出函数 | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FQFP | - | BGA | FQFP | FQFP | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | QFP208,1.2SQ,20 | - | BGA208,16X16,40 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | BGA272,20X20,50 | BGA208,16X16,40 | BGA272,20X20,50 | BGA208,16X16,40 | BGA272,20X20,50 |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, FINE PITCH | - | GRID ARRAY | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
电源 | 2.5/3.3,3.3 V | - | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
可编程逻辑类型 | EE PLD | - | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | 9.5 ns | - | 13 ns | 13 ns | 19 ns | 9.5 ns | 19 ns | 13 ns | 9.5 ns | 19 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.1 mm | - | 2.1 mm | 4.1 mm | 4.1 mm | 2.8 mm | 2.1 mm | 2.8 mm | 2.1 mm | 2.8 mm |
最大供电电压 | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | - | BALL | GULL WING | GULL WING | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.5 mm | - | 1 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1 mm | 1.27 mm | 1 mm | 1.27 mm |
端子位置 | QUAD | - | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 28 mm | - | 17 mm | 28 mm | 28 mm | 27 mm | 17 mm | 27 mm | 17 mm | 27 mm |
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