32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369D-01, DPAK-3
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | CASE 369D-01, DPAK-3 |
| 针数 | 3 |
| 制造商包装代码 | CASE 369D-01 |
| Reach Compliance Code | unknown |
| 雪崩能效等级（Eas） | 71.7 mJ |
| 外壳连接 | DRAIN |
| 配置 | SINGLE WITH BUILT-IN DIODE |
| 最小漏源击穿电压 | 25 V |
| 最大漏极电流 (ID) | 32 A |
| 最大漏源导通电阻 | 0.013 Ω |
| FET 技术 | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 代码 | R-PSIP-T3 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | NOT SPECIFIED |
| 元件数量 | 1 |
| 端子数量 | 3 |
| 工作模式 | ENHANCEMENT MODE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 极性/信道类型 | N-CHANNEL |
| 最大脉冲漏极电流 (IDM) | 140 A |
| 认证状态 | COMMERCIAL |
| 表面贴装 | NO |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | SINGLE |
| 处于峰值回流温度下的最长时间 | 30 |
| 晶体管应用 | SWITCHING |
| 晶体管元件材料 | SILICON |
| NTD70N03R-1 | NTD70N03R-1G | NTD70N03RG | NTD70N03RT4G | NTD70N03RT4 | NTD70N03R | |
|---|---|---|---|---|---|---|
| 描述 | 32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369D-01, DPAK-3 | 32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369D-01, DPAK-3 | 32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369AA-01, DPAK-3 | 32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 369AA-01, DPAK-3 | 32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369AA-01, DPAK-3 | 32A, 25V, 0.013ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 369AA-01, DPAK-3 |
| 是否无铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | CASE 369D-01, DPAK-3 | LEAD FREE, CASE 369D-01, DPAK-3 | LEAD FREE, CASE 369AA-01, DPAK-3 | LEAD FREE, CASE 369AA-01, DPAK-3 | CASE 369AA-01, DPAK-3 | CASE 369AA-01, DPAK-3 |
| 针数 | 3 | 3 | 3 | 3 | 3 | 3 |
| 制造商包装代码 | CASE 369D-01 | CASE 369D-01 | CASE 369AA-01 | CASE 369AA-01 | CASE 369AA-01 | CASE 369AA-01 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 雪崩能效等级（Eas） | 71.7 mJ | 71.7 mJ | 71.7 mJ | 71.7 mJ | 71.7 mJ | 71.7 mJ |
| 外壳连接 | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN |
| 配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
| 最小漏源击穿电压 | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V |
| 最大漏极电流 (ID) | 32 A | 32 A | 32 A | 32 A | 32 A | 32 A |
| 最大漏源导通电阻 | 0.013 Ω | 0.013 Ω | 0.013 Ω | 0.013 Ω | 0.013 Ω | 0.013 Ω |
| FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 代码 | R-PSIP-T3 | R-PSIP-T3 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 |
| JESD-609代码 | e0 | e3 | e3 | e3 | e0 | e0 |
| 湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | 1 | NOT SPECIFIED | 1 | 1 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 3 | 3 | 2 | 2 | 2 | 2 |
| 工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 240 | NOT SPECIFIED | 260 | NOT SPECIFIED | 240 | 240 |
| 极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
| 最大脉冲漏极电流 (IDM) | 140 A | 140 A | 140 A | 140 A | 140 A | 140 A |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 表面贴装 | NO | NO | YES | YES | YES | YES |
| 端子面层 | TIN LEAD | MATTE TIN | TIN | MATTE TIN | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 40 | NOT SPECIFIED | 30 | 30 |
| 晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
| 晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
