Si4412DY
June 1999
Si4412DY*
Single N-Channel Logic Level PowerTrench
®
MOSFET
General Description
This N-Channel Logic Level MOSFET is produced using
Fairchild Semiconductor's advanced PowerTrench process
that has been especially tailored to minimize on-state
resistance and yet maintain superior switching
performance.
This device is well suited for low voltage and battery
powered applications where low in-line power loss and
fast switching are required.
Features
7 A, 30 V. R
DS(ON)
= 0.028
Ω
@ V
GS
= 10 V
R
DS(ON)
= 0.042
Ω
@ V
GS
= 4.5 V
Low gate charge.
Fast switching speed.
High performance trench technology for extremely
low R
DS(ON)
.
High power and current handling capability.
Applications
Battery switch
Load switch
Motor controls
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©1999
Fairchild Semiconductor Corporation
Si4412DY Rev. A
Si4412DY
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Notes:
1:
R
θJA
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is
drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
defined as the solder mounting surface of the
a) 50° C/W when
mounted on a 1 in
2
pad of 2 oz. copper.
b) 105° C/W when
mounted on a 0.04 in
2
pad of 2 oz. copper.
c) 125° C/W on a minimum
mounting pad.
Scale 1 : 1 on letter size paper
2:
Pulse Test: Pulse Width
≤
300
µs,
Duty Cycle
≤
2.0%
Si4412DY Rev. A
SOIC-8 Tape and Reel Data
SOIC(8lds) Packaging
Configuration:
Figure 1.0
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
TION
A
TTEN
ATTENTION
Packaging Description:
SOIC-8 parts are shipped in tape. The carrier tape is
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
2,500 units per 13" or 330cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). Other option comes in 500 units per 7" or
177cm diameter reel. This and some other options are
further described in the Packaging Information table.
These full reels are individually barcode labeled and
placed inside a standard intermediate box (illustrated in
figure 1.0) made of recyclable corrugated brown paper.
One box contains two reels maximum. And these boxes
are placed inside a barcode labeled shipping box which
comes in different sizes depending on the number of parts
shipped.
Embossed ESD Marking
Antistatic Cover Tape
ONS
ECAUTI
VE PR
LING
OBSER
R
HAND
TATIC
FO TROS
ELEC ITIVE
SENS CES
DEVI
Static Dissipative
Embossed Carrier Tape
F63TNR
Label
Customized
Label
F852
NDS
9959
F852
NDS
9959
F852
NDS
9959
F852
NDS
9959
SOIC (8lds) Packaging Information
Packaging Option
Packaging type
Qty per Reel/Tube/Bag
Reel Size
Box Dimension (mm)
Max qty per Box
Weight per unit (gm)
Weight per Reel (kg)
Note/Comments
Standard
(no flow code)
TNR
2,500
13" Dia
355x333x40
5,000
0.0774
0.6060
L86Z
Rail/Tube
95
-
530x130x83
30,000
0.0774
-
F011
TNR
4,000
13" Dia
355x333x40
8,000
0.0774
0.9696
D84Z
TNR
500
7" Dia
193x183x80
2,000
0.0774
0.1182
F852
NDS
9959
Pin 1
SOIC-8 Unit Orientation
Barcode Label
Barcode
Label
355mm x 333mm x 40mm
Intermediate container for 13” reel option
F63TNR Label sample
Barcode
Label
193mm x 183mm x 80mm
Pizza Box for Standard Option
SOIC(8lds) Tape Leader and Trailer
Configuration:
Figure 2.0
LOT: CBVK741B019
FSID: FDS9953A
QTY: 2500
SPEC:
D/C1: Z 9842AB
D/C2:
QTY1:
QTY2:
SPEC REV:
CPN:
N/F: F
(F63TNR)3
Carrier Tape
Cover Tape
Components
Trailer Tape
640mm minimum or
80 empty pockets
Leader Tape
1680mm minimum or
210 empty pockets
©2001 Fairchild Semiconductor Corporation
January 2001, Rev. C
SOIC-8 Tape and Reel Data, continued
SOIC(8lds) Embossed Carrier Tape
Configuration:
Figure 3.0
T
E1
P0
D0
F
K0
Wc
B0
E2
W
Tc
A0
P1
D1
User Direction of Feed
Dimensions are in millimeter
Pkg type
SOIC(8lds)
(12mm)
A0
5.30
+/-0.10
B0
6.50
+/-0.10
W
12.0
+/-0.3
D0
1.55
+/-0.05
D1
1.60
+/-0.10
E1
1.75
+/-0.10
E2
10.25
min
F
5.50
+/-0.05
P1
8.0
+/-0.1
P0
4.0
+/-0.1
K0
2.1
+/-0.10
T
0.450
+/-
0.150
Wc
9.2
+/-0.3
Tc
0.06
+/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum
Typical
component
cavity
center line
0.5mm
maximum
B0
20 deg maximum component rotation
0.5mm
maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0
Sketch B (Top View)
Typical
component
center line
Sketch C (Top View)
Component lateral movement
SOIC(8lds) Reel Configuration:
Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A
Max
Dim A
max
Dim N
See detail AA
7" Diameter Option
B Min
Dim C
See detail AA
W3
Dim D
min
13" Diameter Option
W2 max Measured at Hub
DETAIL AA
Dimensions are in inches and millimeters
Tape Size
12mm
Reel
Option
7" Dia
Dim A
7.00
177.8
13.00
330
Dim B
0.059
1.5
0.059
1.5
Dim C
512 +0.020/-0.008
13 +0.5/-0.2
512 +0.020/-0.008
13 +0.5/-0.2
Dim D
0.795
20.2
0.795
20.2
Dim N
2.165
55
7.00
178
Dim W1
0.488 +0.078/-0.000
12.4 +2/0
0.488 +0.078/-0.000
12.4 +2/0
Dim W2
0.724
18.4
0.724
18.4
Dim W3 (LSL-USL)
0.469 – 0.606
11.9 – 15.4
0.469 – 0.606
11.9 – 15.4
12mm
13" Dia
1998 Fairchild Semiconductor Corporation
January 2001, Rev. C
SOIC-8 Package Dimensions
SOIC-8 (FS PKG Code S1)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Part Weight per unit (gram): 0.0774
9
©2000 Fairchild Semiconductor International
September 1998, Rev. A
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