EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Catalyst |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.9 mm |
| 内存密度 | 32768 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 2/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 9e-7 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| CAT24FC32AK-TE13 | CAT24FC32AY-TE13 | CAT24FC32AU-TE13 | CAT24FC32AJ-TE13 | CAT24FC32AP | CAT24FC32AW-TE13 | CAT24FC32AL | CAT24FC32AX-TE13 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 4KX8, Serial, CMOS, PDSO8, LEAD FREE, TSSOP-8 | EEPROM, 4KX8, Serial, CMOS, PDSO8, TSSOP-8 | EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 4KX8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | EEPROM, 4KX8, Serial, CMOS, PDSO8, LEAD FREE, SOIC-8 | EEPROM, 4KX8, Serial, CMOS, PDIP8, LEAD FREE, PLASTIC, DIP-8 | EEPROM, 4KX8, Serial, CMOS, PDSO8, LEAD FREE, SOIC-8 |
| 是否Rohs认证 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | DIP | SOIC | DIP | SOIC |
| 包装说明 | SOP, SOP8,.3 | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.3 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e3 | e0 | e0 | e0 | e3 | e3 | e3 |
| 长度 | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm | 9.59 mm | 4.9 mm | 9.59 mm | 4.9 mm |
| 内存密度 | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit | 32768 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 | 4KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | TSSOP | SOP | DIP | SOP | DIP | SOP |
| 封装等效代码 | SOP8,.3 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | DIP8,.3 | SOP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 240 | 260 | 240 | 240 | 240 | 260 | 260 | 260 |
| 电源 | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V | 2/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm | 4.57 mm | 1.75 mm | 4.57 mm | 1.75 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 40 | 40 | 40 |
| 宽度 | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 7.62 mm | 3.9 mm | 7.62 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| 写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| 厂商名称 | Catalyst | - | Catalyst | - | - | Catalyst | Catalyst | Catalyst |
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