11 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PBGA16, 4 X 4 MM, PLASTIC, FCBGA-16
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ON Semiconductor(安森美) |
零件包装代码 | BGA |
包装说明 | 4 X 4 MM, PLASTIC, FCBGA-16 |
针数 | 16 |
Reach Compliance Code | compliant |
其他特性 | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
系列 | 11 |
输入调节 | DIFFERENTIAL |
JESD-30 代码 | S-PBGA-B16 |
长度 | 4 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER |
功能数量 | 1 |
反相输出次数 | |
端子数量 | 16 |
实输出次数 | 2 |
最高工作温度 | 70 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 0.16 ns |
认证状态 | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.015 ns |
座面最大高度 | 1.4 mm |
最大供电电压 (Vsup) | 3.465 V |
最小供电电压 (Vsup) | 2.375 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
温度等级 | OTHER |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
最小 fmax | 10709 MHz |
NBSG11BAG | NBSG11MA1TBG | NBSG11BAR2G | NBSG11MAHTBG | |
---|---|---|---|---|
描述 | 11 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PBGA16, 4 X 4 MM, PLASTIC, FCBGA-16 | 11 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PBGA16, 4 X 4 MM, 0.96 MM HEIGHT, LEAD FREE, FCLGA-16 | 11 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PBGA16, 4 X 4 MM, PLASTIC, FCBGA-16 | 11 SERIES, LOW SKEW CLOCK DRIVER, 2 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PBGA16, 4 X 4 MM, 1 MM HEIGHT, LEAD FREE, FCLGA-16 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | BGA | LGA | BGA | LGA |
包装说明 | 4 X 4 MM, PLASTIC, FCBGA-16 | TBGA, LGA16,4X4,40 | 4 X 4 MM, PLASTIC, FCBGA-16 | TBGA, |
针数 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | compliant | unknown |
其他特性 | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V | NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V |
系列 | 11 | 11 | 11 | 11 |
输入调节 | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
JESD-30 代码 | S-PBGA-B16 | S-PBGA-B16 | S-PBGA-B16 | S-PBGA-B16 |
长度 | 4 mm | 4 mm | 4 mm | 4 mm |
逻辑集成电路类型 | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 |
实输出次数 | 2 | 2 | 2 | 2 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | TBGA | LBGA | TBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED |
传播延迟(tpd) | 0.16 ns | 0.16 ns | 0.16 ns | 0.16 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | 0.015 ns | 0.015 ns | 0.015 ns | 0.015 ns |
座面最大高度 | 1.4 mm | 1.03 mm | 1.4 mm | 1.03 mm |
最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 (Vsup) | 2.375 V | 2.375 V | 2.375 V | 2.375 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子形式 | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 40 | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | 4 mm | 4 mm | 4 mm |
最小 fmax | 10709 MHz | 10709 MHz | 10709 MHz | 10709 MHz |
厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | ON Semiconductor(安森美) |
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