3-Line To 8-Line decoder/Demultiplexer 16-VQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | QFN-16 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Is Samacsys | N |
| 其他特性 | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS |
| 系列 | LVC/LCX/Z |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PQCC-N16 |
| JESD-609代码 | e4 |
| 长度 | 4 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 2 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16/20,.14X.16,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Su | 6.7 ns |
| 传播延迟（tpd） | 22 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.5 mm |
| Base Number Matches | 1 |
| SN74LVC138ARGYR | SN74LVC138AD | SN74LVC138ADBR | SN74LVC138ADGVR | SN74LVC138APW | SN74LVC138APWT | |
|---|---|---|---|---|---|---|
| 描述 | 3-Line To 8-Line decoder/Demultiplexer 16-VQFN -40 to 85 | 3-Line To 8-Line decoder/Demultiplexer 16-SOIC -40 to 85 | 3-Line To 8-Line decoder/Demultiplexer 16-SSOP -40 to 85 | 3-Line To 8-Line decoder/Demultiplexer 16-TVSOP -40 to 85 | Decoder/Demultiplexer Single 3-to-8 16-Pin TSSOP Tube | Decoder/Demultiplexer Single 3-to-8 16-Pin TSSOP T/R |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | SOIC | SOIC | SOIC | - | TSSOP |
| 包装说明 | QFN-16 | SOIC-16 | SSOP-16 | TSSOP, TSSOP16,.25,16 | - | TSSOP, TSSOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | - | 16 |
| Reach Compliance Code | compli | compli | compli | compli | - | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | - | 1 week |
| 其他特性 | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | - | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | - | LVC/LCX/Z |
| 输入调节 | STANDARD | STANDARD | STANDARD | STANDARD | - | STANDARD |
| JESD-30 代码 | R-PQCC-N16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | - | e4 |
| 长度 | 4 mm | 9.9 mm | 6.2 mm | 4.4 mm | - | 5 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | - | 0.024 A |
| 湿度敏感等级 | 2 | 1 | 1 | 1 | - | 1 |
| 位数 | 8 | 8 | 8 | 8 | - | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | - | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | - | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SOP | SSOP | TSSOP | - | TSSOP |
| 封装等效代码 | LCC16/20,.14X.16,20 | SOP16,.25 | SSOP16,.3 | TSSOP16,.25,16 | - | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TR | TUBE | TR | TR | - | TR |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - | 260 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| 最大电源电流（ICC） | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - | 0.01 mA |
| Prop。Delay @ Nom-Su | 6.7 ns | 6.7 ns | 6.7 ns | 6.7 ns | - | - |
| 传播延迟（tpd） | 22 ns | 22 ns | 22 ns | 22 ns | - | 22 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1 mm | 1.75 mm | 2 mm | 1.2 mm | - | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | - | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V |
| 表面贴装 | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | GULL WING | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 0.65 mm | 0.4 mm | - | 0.65 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 3.5 mm | 3.9 mm | 5.3 mm | 3.6 mm | - | 4.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 |
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