Decoder/Demultiplexer Single 3-to-8 16-Pin TSSOP Tube
| 参数名称 | 属性值 |
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| SVHC | Yes |
| Logic Family | LVC |
| Logic Function | Decoder/Demultiplexer |
| Demultiplexing Capability | 1-of-8 |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 3 |
| Number of Input Enables per Element | 3 |
| Number of Element Outputs | 8 |
| Number of Output Enables per Element | 0 |
| Polarity | Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 7.9@2.7V|6.7@3.3V |
| Absolute Propagation Delay Time (ns) | 22 |
| Process Technology | CMOS |
| Maximum Low Level Output Current (mA) | 24 |
| Maximum High Level Output Current (mA) | -24 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (mA) | 0.01 |
| Propagation Delay Test Condition (pF) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| 系列 Packaging | Tube |
| Pin Count | 16 |
| Supplier Package | TSSOP |
| Standard Package Name | SOP |
| Mounting | Surface Mount |
| Package Height | 1.05(Max) |
| Package Length | 5.1(Max) |
| Package Width | 4.5(Max) |
| PCB changed | 16 |
| Lead Shape | Gull-wing |
| SN74LVC138APW | SN74LVC138AD | SN74LVC138ADBR | SN74LVC138ADGVR | SN74LVC138APWT | SN74LVC138ARGYR | |
|---|---|---|---|---|---|---|
| 描述 | Decoder/Demultiplexer Single 3-to-8 16-Pin TSSOP Tube | 3-Line To 8-Line decoder/Demultiplexer 16-SOIC -40 to 85 | 3-Line To 8-Line decoder/Demultiplexer 16-SSOP -40 to 85 | 3-Line To 8-Line decoder/Demultiplexer 16-TVSOP -40 to 85 | Decoder/Demultiplexer Single 3-to-8 16-Pin TSSOP T/R | 3-Line To 8-Line decoder/Demultiplexer 16-VQFN -40 to 85 |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | - | SOIC | SOIC | SOIC | TSSOP | QFN |
| 包装说明 | - | SOIC-16 | SSOP-16 | TSSOP, TSSOP16,.25,16 | TSSOP, TSSOP16,.25 | QFN-16 |
| 针数 | - | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | - | compli | compli | compli | compliant | compli |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | - | 1 week | 1 week | 1 week | 1 week | 1 week |
| 其他特性 | - | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS | TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| 输入调节 | - | STANDARD | STANDARD | STANDARD | STANDARD | STANDARD |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PQCC-N16 |
| JESD-609代码 | - | e4 | e4 | e4 | e4 | e4 |
| 长度 | - | 9.9 mm | 6.2 mm | 4.4 mm | 5 mm | 4 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 最大I（ol） | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 2 |
| 位数 | - | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | - | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SOP | SSOP | TSSOP | TSSOP | HVQCCN |
| 封装等效代码 | - | SOP16,.25 | SSOP16,.3 | TSSOP16,.25,16 | TSSOP16,.25 | LCC16/20,.14X.16,20 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | - | TUBE | TR | TR | TR | TR |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最大电源电流（ICC） | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| Prop。Delay @ Nom-Su | - | 6.7 ns | 6.7 ns | 6.7 ns | - | 6.7 ns |
| 传播延迟（tpd） | - | 22 ns | 22 ns | 22 ns | 22 ns | 22 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 2 mm | 1.2 mm | 1.2 mm | 1 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | - | 1.27 mm | 0.65 mm | 0.4 mm | 0.65 mm | 0.5 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 3.9 mm | 5.3 mm | 3.6 mm | 4.4 mm | 3.5 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
嵌入式系统
模拟与混合信号
嵌入式系统
微控制器 MCU
FPGA/CPLD
电子竞赛
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
