Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40
| 参数名称 | 属性值 |
| 厂商名称 | SHARP |
| 包装说明 | 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 170 ns |
| 其他特性 | 100000 BLOCK ERASE CYCLES |
| JESD-30 代码 | R-PDSO-G40 |
| JESD-609代码 | e6 |
| 长度 | 18.4 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 组织 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 编程电压 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | TIN BISMUTH |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 类型 | NOR TYPE |
| 宽度 | 10 mm |
| LH28F008SCHT-TL12 | LH28F008SCHR-TL85 | LH28F008SCHT-TL85 | LH28F008SCHN-TL85 | LH28F008SCHB-TL85 | LH28F008SCHR-TL12 | LH28F008SCHN-TL12 | LH28F008SCHB-TL12 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | Flash, 1MX8, 150ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | Flash, 1MX8, 150ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 150ns, PBGA42, 8 X 8 MM, CSP-42 | Flash, 1MX8, 170ns, PDSO40, 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | Flash, 1MX8, 170ns, PDSO44, 0.525 X 1.110 INCH, PLASTIC, SOP-44 | Flash, 1MX8, 170ns, PBGA42, 8 X 8 MM, CSP-42 |
| 厂商名称 | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP | SHARP |
| 包装说明 | 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | 10 X 20 MM, 1.20 MM HEIGHT, TSOP-40 | 0.525 X 1.110 INCH, PLASTIC, SOP-44 | 8 X 8 MM, CSP-42 | 10 X 20 MM, 1.20 MM HEIGHT, REVERSE, TSOP-40 | 0.525 X 1.110 INCH, PLASTIC, SOP-44 | 8 X 8 MM, CSP-42 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 170 ns | 150 ns | 150 ns | 150 ns | 150 ns | 170 ns | 170 ns | 170 ns |
| 其他特性 | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES | 100000 BLOCK ERASE CYCLES |
| JESD-30 代码 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G40 | R-PDSO-G44 | R-PBGA-B42 | R-PDSO-G40 | R-PDSO-G44 | R-PBGA-B42 |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 40 | 40 | 44 | 42 | 40 | 44 | 42 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1-R | TSOP1 | SOP | BGA | TSOP1-R | SOP | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | GRID ARRAY | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | BALL | GULL WING | GULL WING | BALL |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL | BOTTOM |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| JESD-609代码 | e6 | e6 | e6 | e6 | - | e0 | e0 | e0 |
| 长度 | 18.4 mm | 18.4 mm | 18.4 mm | 28.2 mm | - | 18.4 mm | 28.2 mm | - |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 3.15 mm | - | 1.2 mm | 3.15 mm | - |
| 端子面层 | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | TIN BISMUTH | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | - | 0.5 mm | 1.27 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 10 mm | 10 mm | 13.2 mm | - | 10 mm | 13.2 mm | - |
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