32-BIT, 333MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | BGA |
包装说明 | LFBGA, |
针数 | 489 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.3 |
地址总线宽度 | |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 66.67 MHz |
外部数据总线宽度 | |
格式 | FLOATING POINT |
集成缓存 | YES |
JESD-30 代码 | S-PBGA-B489 |
长度 | 19 mm |
低功率模式 | YES |
端子数量 | 489 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
认证状态 | Not Qualified |
座面最大高度 | 1.61 mm |
速度 | 333 MHz |
最大供电电压 | 1.05 V |
最小供电电压 | 0.95 V |
标称供电电压 | 1 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
宽度 | 19 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
MPC8309VMAFFCA | MPC8309VMAGFCA | MPC8309CVMAFFCA | MPC8309CVMAGFCA | MPC8309VMADFCA | |
---|---|---|---|---|---|
描述 | 32-BIT, 333MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489 | 32-BIT, 333MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489 | 32-BIT, 266MHz, RISC PROCESSOR, PBGA489, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-489 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA |
包装说明 | LFBGA, | LFBGA, | LFBGA, | LFBGA, | LFBGA, |
针数 | 489 | 489 | 489 | 489 | 489 |
Reach Compliance Code | unknown | unknown | unknow | unknow | unknow |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
位大小 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES |
最大时钟频率 | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz | 66.67 MHz |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES |
JESD-30 代码 | S-PBGA-B489 | S-PBGA-B489 | S-PBGA-B489 | S-PBGA-B489 | S-PBGA-B489 |
长度 | 19 mm | 19 mm | 19 mm | 19 mm | 19 mm |
低功率模式 | YES | YES | YES | YES | YES |
端子数量 | 489 | 489 | 489 | 489 | 489 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.61 mm | 1.61 mm | 1.61 mm | 1.61 mm | 1.61 mm |
速度 | 333 MHz | 400 MHz | 333 MHz | 400 MHz | 266 MHz |
最大供电电压 | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
最小供电电压 | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V |
标称供电电压 | 1 V | 1 V | 1 V | 1 V | 1 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 19 mm | 19 mm | 19 mm | 19 mm | 19 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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