EDO DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44
参数名称 | 属性值 |
厂商名称 | Micron Technology |
零件包装代码 | TSOP |
包装说明 | TSOP2, |
针数 | 50/44 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE WITH EDO |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS REFRESH |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
长度 | 20.95 mm |
内存密度 | 16777216 bit |
内存集成电路类型 | EDO DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 44 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
认证状态 | Not Qualified |
刷新周期 | 1024 |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 3.47 V |
最小供电电压 (Vsup) | 3.13 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
MT4LC1M16H5TG-70TR | MT4LC1M16H5DJ-70 | MT4LC1M16H5DJ-52TR | MT4LC1M16H5TG-60TR | MT4LC1M16H5TG-52TR | MT4LC1M16H5DJ-70TR | MT4LC1M16H5TG-70 | MT4LC1M16H5DJ-60TR | |
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描述 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, PLASTIC, SOJ-42 | EDO DRAM, 1MX16, 52ns, CMOS, PDSO42, 0.400 INCH, PLASTIC, SOJ-42 | EDO DRAM, 1MX16, 60ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | EDO DRAM, 1MX16, 52ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO42, 0.400 INCH, PLASTIC, SOJ-42 | EDO DRAM, 1MX16, 70ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP-50/44 | EDO DRAM, 1MX16, 60ns, CMOS, PDSO42, 0.400 INCH, PLASTIC, SOJ-42 |
厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
零件包装代码 | TSOP | SOJ | SOJ | TSOP | TSOP | SOJ | TSOP | SOJ |
包装说明 | TSOP2, | SOJ, | SOJ, | TSOP2, | TSOP2, | SOJ, | TSOP2, | SOJ, |
针数 | 50/44 | 42 | 42 | 50/44 | 50/44 | 42 | 50/44 | 42 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
最长访问时间 | 70 ns | 70 ns | 52 ns | 60 ns | 52 ns | 70 ns | 70 ns | 60 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH |
JESD-30 代码 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-J42 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J42 | R-PDSO-G44 | R-PDSO-J42 |
长度 | 20.95 mm | 27.33 mm | 27.33 mm | 20.95 mm | 20.95 mm | 27.33 mm | 20.95 mm | 27.33 mm |
内存密度 | 16777216 bit | 16777216 bi | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 42 | 42 | 44 | 44 | 42 | 44 | 42 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | TSOP2 | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
座面最大高度 | 1.2 mm | 3.76 mm | 3.76 mm | 1.2 mm | 1.2 mm | 3.76 mm | 1.2 mm | 3.76 mm |
最大供电电压 (Vsup) | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V |
最小供电电压 (Vsup) | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | J BEND | J BEND | GULL WING | GULL WING | J BEND | GULL WING | J BEND |
端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.21 mm | 10.21 mm | 10.16 mm | 10.16 mm | 10.21 mm | 10.16 mm | 10.21 mm |
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