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MB8464R-70LLPF: 产品描述Standard SRAM, 8KX8, 70ns, CMOS, PDSO28; 产品类别存储存储; 文件大小391KB，共16页; 制造商FUJITSU(富士通); 官网地址http://edevice.fujitsu.com/fmd/en/index.html

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MB8464R-70LLPF概述

Standard SRAM, 8KX8, 70ns, CMOS, PDSO28

MB8464R-70LLPF规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	FUJITSU(富士通)
零件包装代码	SOIC
包装说明	SOP, SOP28,.45
针数	28
Reach Compliance Code	unknown
最长访问时间	70 ns
I/O 类型	COMMON
JESD-30 代码	R-PDSO-G28
JESD-609代码	e0
内存密度	65536 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
端子数量	28
字数	8192 words
字数代码	8000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	8KX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP28,.45
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	PARALLEL
电源	5 V
认证状态	Not Qualified
最大待机电流	0.00001 A
最小待机电流	2 V
最大压摆率	0.025 mA
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL

MB8464R-70LLPF相似产品对比

	MB8464R-70LLPF	MB8464R-70LLP	MB8464R-70LLPFTR	MB8464R-70LLPFTN	MB8464R-70LLP-SK	MB8464R-10LLPFTN	MB8464R-10LLPFTR	MB8464R-10LLPF	MB8464R-10LLP-SK	MB8464R-10LLP
描述	Standard SRAM, 8KX8, 70ns, CMOS, PDSO28	Standard SRAM, 8KX8, 70ns, CMOS, PDIP28	Standard SRAM, 8KX8, 70ns, CMOS, PDSO28	Standard SRAM, 8KX8, 70ns, CMOS, PDSO28	8KX8 STANDARD SRAM, 70ns, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28	Standard SRAM, 8KX8, 100ns, CMOS, PDSO28	Standard SRAM, 8KX8, 100ns, CMOS, PDSO28	Standard SRAM, 8KX8, 100ns, CMOS, PDSO28	8KX8 STANDARD SRAM, 100ns, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28	Standard SRAM, 8KX8, 100ns, CMOS, PDIP28
厂商名称	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)	FUJITSU(富士通)
零件包装代码	SOIC	DIP	TSOP	TSOP	DIP	TSOP	TSOP	SOIC	DIP	DIP
包装说明	SOP, SOP28,.45	DIP, DIP28,.6	TSSOP, TSSOP28,.53,22	TSSOP, TSSOP28,.53,22	DIP,	TSSOP, TSSOP28,.53,22	TSSOP, TSSOP28,.53,22	SOP, SOP28,.45	DIP,	DIP, DIP28,.6
针数	28	28	28	28	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	70 ns	70 ns	70 ns	70 ns	70 ns	100 ns	100 ns	100 ns	100 ns	100 ns
JESD-30 代码	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-PDIP-T28
内存密度	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	8	8	8	8	8	8	8	8	8	8
端子数量	28	28	28	28	28	28	28	28	28	28
字数	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
字数代码	8000	8000	8000	8000	8000	8000	8000	8000	8000	8000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	DIP	TSSOP	TSSOP	DIP	TSSOP	TSSOP	SOP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最小待机电流	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	YES	NO	YES	YES	YES	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	0.55 mm	0.55 mm	2.54 mm	0.55 mm	0.55 mm	1.27 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
是否Rohs认证	不符合	不符合	不符合	不符合	-	不符合	不符合	不符合	-	不符合
I/O 类型	COMMON	COMMON	COMMON	COMMON	-	COMMON	COMMON	COMMON	-	COMMON
JESD-609代码	e0	e0	e0	e0	-	e0	e0	e0	-	e0
封装等效代码	SOP28,.45	DIP28,.6	TSSOP28,.53,22	TSSOP28,.53,22	-	TSSOP28,.53,22	TSSOP28,.53,22	SOP28,.45	-	DIP28,.6
电源	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V	-	5 V
最大待机电流	0.00001 A	0.00001 A	0.00001 A	0.00001 A	-	0.00001 A	0.00001 A	0.00001 A	-	0.00001 A
最大压摆率	0.025 mA	0.025 mA	0.025 mA	0.025 mA	-	0.025 mA	0.025 mA	0.025 mA	-	0.025 mA
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)

MB8464R-70LLPF

MB8464R-70LLPF概述

MB8464R-70LLPF规格参数

MB8464R-70LLPF相似产品对比

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