Audio Amplifier, 2 Func, CMOS, PDSO8
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | American Power Devices Inc |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
商用集成电路类型 | AUDIO AMPLIFIER |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
功能数量 | 2 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-1.5/+-3/3/6 V |
认证状态 | Not Qualified |
最大压摆率 | 5 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
APA2308OI-TR | APA2308OI-TUL | APA2308OI-TRL | APA2308KI-TR | APA2308KI-TU | APA2308JI-TU | APA2308OI-TU | |
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描述 | Audio Amplifier, 2 Func, CMOS, PDSO8 | Audio Amplifier, 2 Func, CMOS, PDSO8, | Audio Amplifier, 2 Func, CMOS, PDSO8 | Audio Amplifier, 2 Func, CMOS, PDSO8 | Audio Amplifier, 2 Func, CMOS, PDSO8 | Audio Amplifier, 2 Func, CMOS, PDIP8 | Audio Amplifier, 2 Func, CMOS, PDSO8 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | TSSOP | SOP | SOP | DIP | TSSOP |
封装等效代码 | TSSOP8,.25 | TSSOP8,.25 | TSSOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | NOT SPECIFIED | 245; 250 | NOT SPECIFIED | 225; 240 | 225; 240 | NOT SPECIFIED | 225; 240 |
电源 | +-1.5/+-3/3/6 V | +-1.5/+-3/3/6 V | +-1.5/+-3/3/6 V | +-1.5/+-3/3/6 V | +-1.5/+-3/3/6 V | +-1.5/+-3/3/6 V | +-1.5/+-3/3/6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA |
表面贴装 | YES | YES | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30; 40 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 30 |
JESD-609代码 | e0 | e3 | - | e0 | e0 | e0 | e0 |
端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
包装说明 | - | TSSOP, TSSOP8,.25 | TSSOP, TSSOP8,.25 | - | SOP, SOP8,.25 | - | TSSOP, TSSOP8,.25 |
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