The HLB123I is designed for high voltage. High speed switching inductive circuits
and amplifier applications.
Features
•
High Speed Switching
•
Low Saturation Voltage
•
High Reliability
TO-251
Absolute Maximum Ratings
(T
A
=25°C)
•
Maximum Temperatures
Storage Temperature ........................................................................................................................... -50 ~ +150
°C
Junction Temperature ................................................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (T
C
=25°C) .................................................................................................................... 20 W
•
Maximum Voltages and Currents
BV
CBO
Collector to Base Voltage....................................................................................................................... 600 V
BV
CEO
Collector to Emitter Voltage.................................................................................................................... 400 V
BV
EBO
Emitter to Base Voltage.............................................................................................................................. 8 V
I
C
Collector Current (DC) ...................................................................................................................................... 1 A
I
C
Collector Current (Pulse) ................................................................................................................................... 2 A
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CBO
I
EBO
*V
CE(sat)1
*V
CE(sat)2
*V
BE(sat)1
*V
BE(sat)2
*h
FE1
*h
FE2
*h
FE3
T
on
T
stg
T
off
Min.
600
400
8
-
-
-
-
-
-
10
10
6
-
-
-
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
0.4
2.4
0.3
Max.
-
-
-
10
10
0.8
0.9
1.2
1.8
50
-
-
1.1
4
0.7
Unit
V
V
V
uA
uA
V
V
V
V
Test Conditions
I
C
=1mA, I
E
=0
I
C
=10mA, I
B
=0
I
E
=1mA, I
C
=0
V
CB
=600V, I
E
=0
V
BE
=9V, I
C
=0
I
C
=0.1A, I
B
=10mA
I
C
=0.3A, I
B
=30mA
I
C
=0.1A, I
B
=10mA
I
C
=0.3A, I
B
=30Ma
I
C
=0.3A, V
CE
=5V
I
C
=0.5A, V
CE
=5V
I
C
=1A, V
CE
=5V
V
CC
=100V, I
C
=1A, I
B1
=I
B2
=0.2A
V
CC
=100V, I
C
=1A, I
B1
=I
B2
=0.2A
V
CC
=100V, I
C
=1A, I
B1
=I
B2
=0.2A
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
uS
uS
uS
Classification Of hFE1
Rank
Range
HLB123I
B1
10-17
B2
13-22
B3
18-27
B4
23-32
B5
28-37
B6
33-42
B7
38-47
B8
43-50
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100
125 C
o
Spec. No. : HI200202
Issued Date : 2002.06.01
Revised Date : 2005.07.13
Page No. : 2/5
Saturation Voltage & Collector Current
10000
25 C
75 C
o
o
Saturation Voltage (mV)
1000
75 C
o
hFE
10
100
25 C
o
125 C
o
hFE @ V
CE
=5V
V
CE(sat)
@ I
C
=10I
B
10
1
1
10
100
1000
10000
1
10
100
1000
10000
Collector Current I
C
(mA)
Collector Current I
C
(mA)
Saturation Voltage & Collector Current
10000
On Voltage & Collector Current
1000
Saturation Voltage (mV)
V
BE(on)
@ V
CE
=5V
75 C
1000
25 C
o
o
125 C
V
BE(s at)
@ I
C
=10I
B
100
1
10
100
1000
10000
o
On Voltage (mV)
100
1
10
100
1000
Collector Current I
C
(mA)
Collector Current (mA)
Capacitance & Reverse-Biased Volatge
100
10.0
Switching Time & Collector Current
V
CC
=100V, I
C
=5I
B1
=-5I
B2
10
Cob
Switching Time (us)
Tstg
Capacitance (pF)
1.0
Tf
Ton
1
0.1
1
10
100
0.1
0.1
1.0
Reverse-Biased Voltage (V)
Collector Current (A)
HLB123I
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HI200202
Issued Date : 2002.06.01
Revised Date : 2005.07.13
Page No. : 3/5
PD - Tc
25
10
Safe Operating Area
PD(W) , Power Dissipation
20
Collector Current-I
C
(A)
PT=1ms
1
PT=1s
15
10
0.1
PT=100ms
5
0
0
50
100
0.01
Ambient Temperature-T
C
( C )
o
150
200
1
10
100
1000
Forward Voltage-V
CE
(V)
HLB123I
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-251 Dimension
A
Tab
Spec. No. : HI200202
Issued Date : 2002.06.01
Revised Date : 2005.07.13
Page No. : 4/5
M
F
a1
Marking:
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
L B
C
G
Date Code
1 2 3 I
Control Code
Note: Green label is used for pb-free packing
1
2
3
Pin Style: 1.Base 2/Tab.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
C
F
G
H1
K
K1
L
M
a1
a2
Min.
6.35
4.80
1.30
5.40
6.75
0.50
0.40
0.90
2.20
0.40
-
Max.
6.80
5.50
1.70
6.25
8.00
0.90
0.90
1.50
2.40
0.65
*2.30
L
K
K1
H1
a1
*: Typical, Unit: mm
a2
a2
3-Lead TO-251
Plastic Package
HSMC Package Code: I
A
B
C
D
a1
E
G
Marking:
M
F
y1
a1
Pb Free Mark
Pb-Free: "
.
"
(Note)
H
Normal: None
L B
1 2 3 I
Date Code
Control Code
I
H
y1
y1
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
K
K1
H1
a2
y2
a2
y2
a1
DIM
A
B
C
D
E
F
G
H
H1
I
J
K
K1
M
a1
a2
y1
y2
Min.
6.40
-
5.04
-
0.40
0.50
5.90
-
-
-
-
-
-
2.20
0.40
2.10
-
-
Max.
6.80
6.00
5.64
*4.34
0.80
0.90
6.30
*1.80
*9.30
*16.10
*0.80
0.96
*0.76
2.40
0.60
2.50
5
o
3
o
3-Lead TO-251
Plastic Package
HSMC Package Code: I
*: Typical, Unit: mm
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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