IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,SOP,20PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | NXP(恩智浦) |
包装说明 | SOP, SOP20,.4 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Sup | 20000000 Hz |
最大I(ol) | 0.006 A |
功能数量 | 8 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 2/6 V |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
MC74HC374ADW | 54HC374M/B2AJC | MC74HC374AN | 54HC374/BRAJC | MC74HC374ADT | |
---|---|---|---|---|---|
描述 | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,SOP,20PIN,PLASTIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,PLASTIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,TSSOP,20PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | SOP, SOP20,.4 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | TSSOP, TSSOP20,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
JESD-30 代码 | R-PDSO-G20 | S-XQCC-N20 | R-PDIP-T20 | R-XDIP-T20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
功能数量 | 8 | 8 | 8 | 8 | 8 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
封装代码 | SOP | QCCN | DIP | DIP | TSSOP |
封装等效代码 | SOP20,.4 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | TSSOP20,.25 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 0.635 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
负载电容(CL) | 50 pF | - | 50 pF | - | 50 pF |
最大I(ol) | 0.006 A | - | 0.006 A | - | 0.006 A |
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