IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 20000000 Hz |
| 最大I（ol） | 0.006 A |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| MC74HC374AN | 54HC374M/B2AJC | MC74HC374ADW | 54HC374/BRAJC | MC74HC374ADT | |
|---|---|---|---|---|---|
| 描述 | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,PLASTIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,SOP,20PIN,PLASTIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,HC-CMOS,TSSOP,20PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | SOP, SOP20,.4 | DIP, DIP20,.3 | TSSOP, TSSOP20,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| JESD-30 代码 | R-PDIP-T20 | S-XQCC-N20 | R-PDSO-G20 | R-XDIP-T20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | SOP | DIP | TSSOP |
| 封装等效代码 | DIP20,.3 | LCC20,.35SQ | SOP20,.4 | DIP20,.3 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.635 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 负载电容（CL） | 50 pF | - | 50 pF | - | 50 pF |
| 最大I（ol） | 0.006 A | - | 0.006 A | - | 0.006 A |
ADI参考电路
移动便携
单片机
FPGA/CPLD
FPGA/CPLD
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