SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | TSSOP |
| 包装说明 | 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HTSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 1.1 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 4.4 mm |
| MAX3265CUE | MAX3768CUB | MAX3765CUB | MAX3269CUB | MAX3269CUB+ | MAX3265EUE | MAX3265CUB | MAX3264CUE | MAX3268CUB | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 | SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | SPECIALTY TELECOM CIRCUIT, PDSO10, LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 | SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | SPECIALTY TELECOM CIRCUIT, PDSO16, 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 | SPECIALTY TELECOM CIRCUIT, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | LEAD FREE, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | 4.40 MM, EXPOSED PAD, MO-153ABT, TSSOP-16 | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 |
| 针数 | 16 | 10 | 10 | 10 | 10 | 16 | 10 | 16 | 10 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDSO-G16 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | R-PDSO-G16 | S-PDSO-G10 | R-PDSO-G16 | S-PDSO-G10 |
| JESD-609代码 | e3 | e0 | e0 | e0 | e3 | e3 | e0 | e0 | e0 |
| 长度 | 5 mm | 3 mm | 3 mm | 3 mm | 3 mm | 5 mm | 3 mm | 5 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 10 | 10 | 10 | 10 | 16 | 10 | 16 | 10 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 245 | 245 | 240 | 260 | 240 | 240 | 245 | 240 |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | TIN LEAD | TIN LEAD | TIN LEAD | TIN | MATTE TIN | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 | 30 | 20 | 20 | NOT SPECIFIED | 20 |
| 宽度 | 4.4 mm | 3 mm | 3 mm | 3 mm | 3 mm | 4.4 mm | 3 mm | 4.4 mm | 3 mm |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | - | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
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