LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, BGA4, GREEN, DSBGA-4
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | BGA |
| 包装说明 | GREEN, DSBGA-4 |
| 针数 | 4 |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | S-XBGA-B4 |
| JESD-609代码 | e1 |
| 长度 | 0.9 mm |
| 逻辑集成电路类型 | BUFFER |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输入次数 | 1 |
| 端子数量 | 4 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 9.9 ns |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 0.9 mm |
| SN74LVC1G34YZVR | SN74LVC1G34DBVR | SN74LVC1G34YZPR | SN74LVC1G34DBVT | SN74LVC1G34DCKR | SN74LVC1G34DRLR | SN74LVC1G34YEPR | SN74LVC1G34DCKT | |
|---|---|---|---|---|---|---|---|---|
| 描述 | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, BGA4, GREEN, DSBGA-4 | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, BGA5, GREEN, DSBGA-5 | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, GREEN, PLASTIC, SO-70, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, GREEN, PLASTIC, SOT-553, 5 PIN | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, BGA5, DSBGA-5 | LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5, GREEN, PLASTIC, SO-70, 5 PIN |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | BGA | SOT-23 | BGA | SOT-23 | SOIC | SOT | BGA | SOIC |
| 包装说明 | GREEN, DSBGA-4 | LSSOP, | GREEN, DSBGA-5 | LSSOP, | GREEN, PLASTIC, SO-70, 5 PIN | GREEN, PLASTIC, SOT-553, 5 PIN | DSBGA-5 | GREEN, PLASTIC, SO-70, 5 PIN |
| 针数 | 4 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | unknown | unknown | unknown | unknow | unknow | unknow | unknow | unknow |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | S-XBGA-B4 | R-PDSO-G5 | R-XBGA-B5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-F5 | R-XBGA-B5 | R-PDSO-G5 |
| JESD-609代码 | e1 | e4 | e1 | e4 | e4 | e4 | e0 | e4 |
| 长度 | 0.9 mm | 2.9 mm | 1.4 mm | 2.9 mm | 2 mm | 1.6 mm | 1.4 mm | 2 mm |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 4 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | VFBGA | LSSOP | VFBGA | LSSOP | TSSOP | VSOF | VFBGA | TSSOP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟（tpd） | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns | 9.9 ns |
| 座面最大高度 | 0.5 mm | 1.45 mm | 0.5 mm | 1.45 mm | 1.1 mm | 0.6 mm | 0.5 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 1.8 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER | NICKEL PALLADIUM GOLD | TIN SILVER COPPER | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | TIN LEAD | NICKEL PALLADIUM GOLD |
| 端子形式 | BALL | GULL WING | BALL | GULL WING | GULL WING | FLAT | BALL | GULL WING |
| 端子节距 | 0.5 mm | 0.95 mm | 0.5 mm | 0.95 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm |
| 端子位置 | BOTTOM | DUAL | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 0.9 mm | 1.6 mm | 0.9 mm | 1.6 mm | 1.25 mm | 1.2 mm | 0.9 mm | 1.25 mm |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
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