Floating-Point Digital Signal Processors 272-BGA
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA272,20X20,50 |
| 针数 | 272 |
| Reach Compliance Code | _compli |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 1 week |
| 其他特性 | ALSO OPERATES AT 3.3V SUPPLY |
| 地址总线宽度 | 22 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 300 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FLOATING POINT |
| 集成缓存 | YES |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B272 |
| JESD-609代码 | e0 |
| 长度 | 27 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| DMA 通道数量 | 16 |
| 外部中断装置数量 | 4 |
| 端子数量 | 272 |
| 计时器数量 | 2 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA272,20X20,50 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 1.4,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 65536 |
| 座面最大高度 | 2.57 mm |
| 最大供电电压 | 1.47 V |
| 最小供电电压 | 1.33 V |
| 标称供电电压 | 1.4 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 27 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C6713BGDP300 | TMS320C6713BGDP225 | TMS320C6713BZDP300 | TMS320C6713BZDP225 | TMS32C6713BPYPA167 | TMS32C6713BPYPA200 | TMS32C6713BZDPA200 | TMS32C6713BGDPA200 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Floating-Point Digital Signal Processors 272-BGA | Floating-Point Digital Signal Processors 272-BGA | Floating-Point Digital Signal Processors 272-BGA | Floating-Point Digital Signal Processors 272-BGA | Floating-Point Digital Signal Processors 208-HLQFP | Floating-Point Digital Signal Processors 208-HLQFP | Floating-Point Digital Signal Processors 272-BGA | Floating-Point Digital Signal Processors 272-BGA |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 零件包装代码 | BGA | BGA | BGA | BGA | QFP | QFP | BGA | BGA |
| 包装说明 | BGA, BGA272,20X20,50 | BGA, BGA272,20X20,50 | BGA, BGA272,20X20,50 | BGA, BGA272,20X20,50 | HLFQFP, QFP208,1.2SQ,20 | HLFQFP, QFP208,1.2SQ,20 | BGA, BGA272,20X20,50 | BGA, BGA272,20X20,50 |
| 针数 | 272 | 272 | 272 | 272 | 208 | 208 | 272 | 272 |
| Reach Compliance Code | _compli | _compli | compli | compli | compliant | compliant | compliant | _compli |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 1 week | 6 weeks | 1 week | 1 week | 1 week | 6 weeks | 6 weeks | 6 weeks |
| 其他特性 | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY | ALSO OPERATES AT 3.3V SUPPLY |
| 地址总线宽度 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 桶式移位器 | NO | NO | NO | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 300 MHz | 225 MHz | 300 MHz | 225 MHz | 167 MHz | 200 MHz | 200 MHz | 200 MHz |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 集成缓存 | YES | YES | YES | YES | YES | YES | YES | YES |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B272 | S-PBGA-B272 | S-PBGA-B272 | S-PBGA-B272 | S-PQFP-G208 | S-PQFP-G208 | S-PBGA-B272 | S-PBGA-B272 |
| JESD-609代码 | e0 | e0 | e1 | e1 | e4 | e4 | e1 | e0 |
| 长度 | 27 mm | 27 mm | 27 mm | 27 mm | 28 mm | 28 mm | 27 mm | 27 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 4 | 4 | 3 | 3 |
| DMA 通道数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 外部中断装置数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 272 | 272 | 272 | 272 | 208 | 208 | 272 | 272 |
| 计时器数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 90 °C | 90 °C | 90 °C | 90 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | HLFQFP | HLFQFP | BGA | BGA |
| 封装等效代码 | BGA272,20X20,50 | BGA272,20X20,50 | BGA272,20X20,50 | BGA272,20X20,50 | QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | BGA272,20X20,50 | BGA272,20X20,50 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | 220 | 220 | 260 | 260 | 260 | 260 | 260 | 220 |
| 电源 | 1.4,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V | 1.2,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 |
| 座面最大高度 | 2.57 mm | 2.57 mm | 2.57 mm | 2.57 mm | 1.6 mm | 1.6 mm | 2.57 mm | 2.57 mm |
| 最大供电电压 | 1.47 V | 1.32 V | 1.47 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
| 最小供电电压 | 1.33 V | 1.14 V | 1.33 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.4 V | 1.2 V | 1.4 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | BALL | BALL | BALL | GULL WING | GULL WING | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | QUAD | QUAD | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 27 mm | 27 mm | 27 mm | 27 mm | 28 mm | 28 mm | 27 mm | 27 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 | 符合 | - |
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