AND-OR-Invert Gate, TTL, CDIP14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | AND-OR-INVERT GATE |
最大I(ol) | 0.02 A |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | OPEN-COLLECTOR |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
Prop。Delay @ Nom-Sup | 8.5 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
N74S65F | S54S65F | S54S65F/883B | S54S65F/883C | N74S65A | S54S65W | |
---|---|---|---|---|---|---|
描述 | AND-OR-Invert Gate, TTL, CDIP14 | AND-OR-Invert Gate, TTL, CDIP14 | AND-OR-Invert Gate, TTL, CDIP14 | AND-OR-Invert Gate, TTL, CDIP14 | AND-OR-Invert Gate, TTL, PDIP14 | AND-OR-Invert Gate, TTL, CDFP14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDFP-F14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
最大I(ol) | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | - | -55 °C |
输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DFP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
Prop。Delay @ Nom-Sup | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | NO | NO | NO | NO | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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