256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, MO-153, TSSOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.4 mm |
| 内存密度 | 2048 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| 24AA02-E/STG | 24AA02-E/MSG | 24AA02-E/PG | 24AA02-E/SNG | 24AA02T-E/STG | 24AA02T-E/SNG | 24AA02T-E/MSG | 24AA02T-E/OTG | 24AA02HT-I/MC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, MO-153, TSSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, MO-153, TSSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, PLASTIC, MO-178, SOT-23, 5 PIN | eeprom 2K 256 X 8 serial EE 18v ind 1/2 array WP |
| 组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256 x 8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | TSSOP | MSOP | DIP | SOIC | TSSOP | SOIC | MSOP | SOIC | - |
| 包装说明 | TSSOP, | TSSOP, | DIP, | SOP, | TSSOP, | SOP, | TSSOP, | LSSOP, | - |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 5 | - |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | - |
| JESD-30 代码 | R-PDSO-G8 | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G5 | - |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | - |
| 长度 | 4.4 mm | 3 mm | 9.46 mm | 4.9 mm | 4.4 mm | 4.9 mm | 3 mm | 2.95 mm | - |
| 内存密度 | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | - |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 5 | - |
| 字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | - |
| 字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | - |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | TSSOP | DIP | SOP | TSSOP | SOP | TSSOP | LSSOP | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.1 mm | 1.18 mm | 4.32 mm | 1.75 mm | 1.1 mm | 1.75 mm | 1.18 mm | 1.45 mm | - |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 1.8 V | 1.8 V | 1.7 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| 表面贴装 | YES | YES | NO | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.95 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 40 | 40 | NOT SPECIFIED | 40 | 40 | 40 | 40 | 40 | - |
| 宽度 | 3 mm | 3 mm | 7.62 mm | 3.9 mm | 3 mm | 3.9 mm | 3 mm | 1.63 mm | - |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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